VARIABLE-DEPTH MICRO-CHANNEL STRUCTURE
A variable-depth micro-channel structure includes a substrate. A cured layer is formed on the substrate. A micro-channel embossed in the cured layer has a bottom surface defining two or more different micro-channel depths of the micro-channel. A cured electrical conductor forms a micro-wire in the micro-channel over the bottom surface of the micro-channel and extends across at least a portion of the bottom surface of the micro-channel.
1 . A variable-depth micro-channel structure, comprising:
a substrate;
a cured layer formed on the substrate, the cured layer having a micro-channel embossed therein, the micro-channel having a bottom surface defining two or more different micro-channel depths of the micro-channel; and
a cured electrical conductor forming a micro-wire in the micro-channel over the bottom surface of the micro-channel and extending across at least a portion of the bottom surface of the micro-channel.
2 . The micro-channel structure of claim 1 , wherein the cured electrical conductor extends across the bottom surface of each micro-channel.
3 . The micro-channel structure of claim 1 , wherein each micro-channel in the plurality of micro-channels has a bottom surface wherein at least two different separated portions of the micro-channel have the same depth.
4 . The micro-channel structure of claim 1 , further including a plurality of micro-channels embossed in the cured layer with a micro-wire formed in each micro-channel.
5 . The micro-channel structure of claim 4 , wherein each micro-wire in each micro-channel is electrically connected together.
6 . The micro-channel structure of claim 4 , wherein at least one of the micro-wires in a micro-channel is electrically separate from a micro-wire in a different micro-channel.
7 . The micro-channel structure of claim 1 wherein at least one depth of the micro-channel is in the range of about ten microns to two microns.
8 . The micro-channel structure of claim 1 wherein the width of the micro-channel is in the range of about two microns to twelve microns.
9 . The micro-channel structure of claim 1 wherein the depth of the cured layer is in the range of about four microns to twelve microns.
10 . The micro-channel structure of claim 1 wherein the micro-channel has at least one depth that is in a range of two microns to ten microns less than the cured-layer thickness.
11 . The micro-channel structure of claim 1 wherein the micro-channel has edges on each side of the micro-channel, first portions of the bottom surface having a first depth adjacent to the edges, and a second portion of the bottom surface between the first portions having a second depth.
12 . The micro-channel structure of claim 11 , wherein the first depth is greater than the second depth.
13 . The micro-channel structure of claim 11 , further including three or more portions of the bottom surface having the first depth.
14 . The micro-channel structure of claim 11 , further including two or more portions of the bottom surface having the second depth.
15 . The micro-channel structure of claim 11 , wherein the first portion has a surface substantially parallel to a surface of the cured layer.
16 . The micro-channel structure of claim 10 , wherein the second portion has a surface substantially parallel to a surface of the cured layer.
17 . The micro-channel structure of claim 10 , wherein the first portion has a surface substantially parallel to a surface of the second portion.
18 . The micro-channel structure of claim 1 , further including an electrical connector electrically connected to the micro-wire.
19 . The micro-channel structure of claim 18 , wherein the electrical connector is soldered, sintered, or welded to the cured electrical conductor.
20 . A variable-depth micro-channel structure, comprising:
a substrate; and
a cured layer formed on the substrate, the cured layer having a micro-channel embossed therein, the micro-channel having a bottom surface defining two or more different micro-channel depths of the micro-channel.