IP Library Granted Patent US 9,333,751
Granted Patent B2
US 9,333,751 · App. 13/786,057 · Granted May 10, 2016

Manufacturing method of inkjet head

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Quick Facts
Patent No.
US 9,333,751
App. No.
13/786,057
Granted
May 10, 2016
Kind
B2
Abstract

A process of manufacturing an inkjet head includes forming an electrode part, in which after an electrode is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film; bonding a nozzle plate to an opening end face of a pressure chamber in the groove part by an adhesive after the electrode part is formed; and forming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded.

Claims (7)

1. A manufacturing method of an inkjet head, comprising:

forming an electrode part, in which an electrode having an average surface roughness of a first thickness length is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of the first thickness length is formed on a surface of the electrode, and then, an electrode protection film having a thickness of a second thickness length is formed on a surface of the smoothed film, the first thickness length being less than the second thickness length;

bonding a nozzle plate to an opening end face of a pressure chamber in the groove part with an adhesive after the electrode part is formed; and

forming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded.

2. The method of claim 1 , wherein the smoothed film is formed on surfaces of a plurality of electrode layers.

3. The method of claim 1 , wherein the smoothed film is formed by a coating method.

4. The method of claim 1 , wherein the first thickness length is 0.6 μm and the second thickness length is 1.0 μm.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2024
From: TOSHIBA TEC KABUSHIKI KAISHA
To: RISO TECHNOLOGIES CORPORATION
Reel/Frame 068493/0970 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2013
From: SEKI, MASASHI; SHIMOSATO, MASASHI
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 030580/0702 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2013
From: SEKI, MASASHI; SHIMOSATO, MASASHI
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 029928/0920 →