CHIP-ON-GLASS FOR TOUCH APPLICATIONS
A touch panel assembly device implementing chip-on-glass technology and a method (e.g., process) for making same are described herein. The touch panel assembly includes a touch panel (e.g., a capacitive touch panel). The touch panel includes a substrate formed of insulator material (e.g., glass). The touch panel also includes a plurality of conductors (e.g., transparent conductors, indium tin oxide traces) formed on the substrate. The touch panel assembly further includes an integrated circuit (e.g., a touch chip). The integrated circuit is disposed upon the substrate and is connected (e.g.., mechanically and electrically connected) to one or more conductors included in the plurality of conductors. The integrated circuit is communicatively coupled with the touch panel.
1 . A method for fabricating a touch panel assembly, the method comprising:
providing a touch panel including a substrate having a plurality of electrical connectors formed on the substrate;
applying a conductive adhesive to the substrate; and
disposing an integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly,
wherein the electrical connectors are conductors.
2 . The method as claimed in claim 1 , wherein the step of disposing the integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly includes:
directing connectors of the integrated circuit against the electrical connectors formed on the substrate.
3 . The method as claimed in claim 2 , wherein the step of disposing the integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly includes:
curing the conductive adhesive to form a connection between the connectors of the integrated circuit and the electrical connectors formed on the substrate.
4 . The method as claimed in claim 3 , wherein the step of disposing the integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly includes:
applying an underfill coating between the integrated circuit and the substrate.
5 . The method as claimed in claim 1 , wherein the conductive adhesive is anisotropic conductive film.
6 . The method as claimed in claim 1 , wherein the integrated circuit is a touch chip.
7 . The method as claimed in claim 1 , wherein the electrical connectors formed on the substrate are indium tin oxide traces.
8 . The method as claimed in claim 3 , wherein curing the conductive adhesive is achieved by heating the substrate and the integrated circuit.
9 . A touch panel assembly, comprising:
a touch panel, the touch panel including a substrate formed of insulator material, the touch panel including a plurality of conductors formed on the substrate; and
an integrated circuit, the integrated circuit being disposed upon the substrate and connected to one or more conductors included in the plurality of conductors, the integrated circuit configured for being communicatively coupled with the touch panel.
10 . The touch panel assembly as claimed in claim 9 , further comprising:
a printed circuit board; and
a flexible printed circuit board, the flexible printed circuit board connecting the printed circuit board to the touch panel and the integrated circuit.
11 . The touch panel assembly as claimed in claim 10 , further comprising:
a controller, the controller being communicatively coupled with the touch panel and the integrated circuit, the controller being configured for controlling the touch panel.
12 . The touch panel assembly as claimed in claim 9 , wherein the touch panel is a capacitive touch panel.
13 . The touch panel assembly as claimed in claim 11 , further comprising:
a display screen, the display screen being connected to the touch panel.
14 . The touch panel assembly as claimed in claim 9 , wherein the plurality of conductors are indium tin oxide traces.
15 . The touch panel assembly as claimed in claim 9 , wherein the substrate is formed of glass.
16 . A touch panel assembly, comprising:
a touch panel, the touch panel including a substrate, the touch panel including a plurality of transparent conductors formed on the substrate;
an integrated circuit, the integrated circuit being disposed upon the substrate and bonded to one or more transparent conductors included in the plurality of transparent conductors via a conductive adhesive, the integrated circuit being communicatively coupled with the touch panel;
a display screen, the display screen being connected to the touch panel;
a printed circuit board, the printed circuit board being connected to the touch panel and the integrated circuit via a flexible printed circuit board; and
a controller, the controller being communicatively coupled with the touch panel and the integrated circuit, the controller being configured for controlling the touch panel.
17 . The touch panel assembly as claimed in claim 16 , wherein the controller is disposed upon the printed circuit board.
18 . The touch panel assembly as claimed in claim 16 , wherein the conductive adhesive is anisotropic conductive film.
19 . The touch panel assembly as claimed in claim 16 , wherein the plurality of transparent conductors are indium tin oxide traces.
20 . The touch panel assembly as claimed in claim 16 , wherein the integrated circuit is mechanically and electrically connected to the touch panel.