Isolator
An isolator comprising: a first semiconductor substrate including a first electrical circuit; a second semiconductor substrate including a second electrical circuit; and at least one optical waveguide for data exchange between the first and second electrical circuits.
1 . An isolator comprising:
a first semiconductor substrate including a first electrical circuit;
a second semiconductor substrate including a second electrical circuit;
and at least one optical waveguide for data exchange between the first and second electrical circuits.
2 . An isolator as claimed in claim 1 , in which the first and second semiconductor substrates are provided within a shared chip package.
3 . An isolator as claimed in claim 2 , in which the first substrate is mounted on a first lead frame and the second semiconductor substrate is mounted on a second lead frame.
4 . An isolator as claimed in claim 3 , in which the first and second lead frames, the first and second semiconductor substrates and the at least one optical waveguide are embedded within an insulating material.
5 . An isolator as claimed in claim 1 , in which a distance between the first semiconductor substrate and the second semiconductor substrate is greater than 100 microns
6 . An isolator as claimed in claim 5 , in which the distance between the first and second semiconductor substrates is greater than 200 microns.
7 . An isolator as claimed in claim 5 , in which the distance between the first and second semiconductor substrates is greater than 400 microns.
8 . An isolator as claimed in claim 1 , in which the first electrical circuit includes at least one optical transmitter and the second electrical circuit includes at least one optical receiver.
9 . An isolator as claimed in claim 8 , in which the second electrical circuit includes at least one optical transmitter and the first electrical circuit include at least one optical receiver.
10 . An isolator as claimed in claim 8 , in which the at least one optical transmitter comprises a nano-laser and a modulator.
11 . An isolator as claimed in claim 8 , in which the at least one optical receiver comprises a Schottky Detector.
12 . An isolator as claimed in claim 1 , in which the at last one optical waveguide comprises a photonic wire.
13 . An isolator as claimed in claim 12 , in which the photonic wire is formed of a plastic material.
14 . An isolator as claimed in claim 1 , further including a third semiconductor substrate.
15 . An isolator as claimed in claim 1 , in which the first and second semiconducting substrates are adhered to a shared lead-frame by an insulating material.
16 . An isolator as claimed in claim 1 , in which the photonic wire is formed in situ by photo-polymerization of a photopolymer material.
17 . An isolator as claimed in claim 15 in which at least one of the semiconductor substrates is doped so as to have a reverse based P-N junction therein when it is subjected to a potential.
18 . A method of providing electrical isolation within a single integrated circuit package having a first circuit formed using VLSI technology on a first semiconductor substrate and a second circuit formed using VLSI technology on a second semiconductor substrate, wherein the first and second semiconductor substrates are provided on respective carriers within the integrated circuit package, the method comprising exchanging data between the first and second circuits by way of optical signals conveyed by the photonic waveguides.
19 . A method as claimed in claim 18 , further comprising separating the first and second carriers from each other by at least 50 μm.
20 . A method as claimed in claim 18 , in which the photonic waveguides are formed by photonic wires.