IP Library Granted Patent US 8,678,801
Granted Patent B2
US 8,678,801 · App. 13/788,952 · Granted Mar 25, 2014

Injection mold assembly including an injection mold cavity at least partially defined by a polycrystalline diamond material

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Quick Facts
Patent No.
US 8,678,801
App. No.
13/788,952
Granted
Mar 25, 2014
Kind
B2
Abstract

Embodiments relate to injection mold assemblies that include superhard materials, such as polycrystalline diamond compacts (“PDCs”), and related injection mold presses, components, and methods. The superhard materials are positioned to define at least a portion of a mold cavity for injection molding. Superhard materials may be fully or partially encapsulated by a substrate and the superhard materials and substrate may be secured to the injection mold. Superhard materials may be formed or otherwise separated from a substrate and secured to the injection mold without support of a substrate. Superhard materials may also be attachable to an injection mold to define only a portion of a mold cavity. In an embodiment, an injection mold insert includes a superhard material for insertion into a generic cavity within an injection mold assembly.

Claims (30)

1. An injection mold assembly, comprising:

a first mold plate;

a second mold plate including a runner; and

a molding element secured to one of the first or second mold plates, the first and second mold plates configured to be abutted along respective mating surfaces thereof to form a mold cavity, the molding element including a sintered polycrystalline diamond material having bonded diamond grains defining interstitial regions having a catalyst therein, the sintered polycrystalline diamond material forming at least a portion of the mold cavity.

2. The injection mold assembly of claim 1 wherein the sintered polycrystalline diamond material is bonded to a substrate.

3. The injection mold assembly of claim 2 wherein the substrate includes tungsten carbide.

4. The injection mold assembly of claim 1 wherein the sintered polycrystalline diamond material is at least partially depleted of the catalyst.

5. The injection mold assembly of claim 1 wherein the catalyst includes cobalt.

6. The injection mold assembly of claim 1 wherein the molding element defines a gate positioned and configured to allow material to be conveyed into the mold cavity via the runner of the second mold plate.

7. The injection mold assembly of claim 1 wherein the polycrystalline diamond material includes one or more segments defining at least a portion of the mold cavity, wherein the one or more segments include at least two non-unitary segments including at least one seam therebetween.

8. The injection mold assembly of claim 7 wherein the one or more segments is defined at least partially by two segments that each include the polycrystalline diamond material.

9. An injection mold insert, comprising:

a molding element including a surface defining at least a portion of a mold cavity, the molding element including a sintered polycrystalline diamond material having bonded diamond grains defining interstitial regions having a catalyst therein; and

wherein the molding element is sized and configured to be inserted at least partially into a generic cavity of an injection mold plate, and secured to the injection mold plate.

10. The injection mold insert of claim 9 wherein the sintered polycrystalline diamond material is bonded to a substrate.

11. The injection mold insert of claim 10 wherein the substrate includes tungsten carbide.

12. The injection mold insert of claim 9 wherein the sintered polycrystalline diamond material is at least partially depleted of the catalyst.

13. The injection mold insert of claim 9 wherein the polycrystalline diamond material includes one or more segments defining at least a portion of the mold cavity, wherein the one or more segments include at least two non-unitary segments including at least one seam therebetween.

14. The injection mold insert of claim 9 wherein the molding element defines a gate positioned and configured to allow material to be conveyed into the mold cavity.

15. An injection mold press, comprising:

an injection mold assembly including:

a first mold plate;

a second mold plate; and

a molding element secured to one of the first or second mold plates, the first and second mold plates configured to be abutted along respective mating surfaces thereof to form a mold cavity, the molding element including a sintered polycrystalline diamond material having bonded diamond grains defining interstitial regions having a catalyst therein, the sintered polycrystalline diamond material forming at least a portion of the mold cavity; and

an injection system operably coupled to the injection mold assembly, the injection system configured to convey material into the mold cavity of the injection mold assembly.

16. The injection mold press of claim 15 wherein the second mold plate includes a runner, and wherein the molding element defines a gate positioned and configured to allow the material to be conveyed into the mold cavity via the runner of the second mold plate.

17. The injection mold press of claim 15 wherein the sintered polycrystalline diamond material is bonded to a substrate.

18. The injection mold press of claim 17 wherein the substrate comprises tungsten carbide.

19. The injection mold press of claim 15 wherein the sintered polycrystalline diamond material is at least partially depleted of the catalyst.

20. The injection mold press of claim 15 wherein the polycrystalline diamond material includes one or more segments defining at least a portion of the mold cavity, wherein the one or more segments include at least two non-unitary segments including at least one seam therebetween.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →