IP Library Granted Patent US 8,976,076
Granted Patent B2
US 8,976,076 · App. 13/790,803 · Granted Mar 10, 2015

High-frequency transmission line, antenna, and electronic circuit board

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Quick Facts
Patent No.
US 8,976,076
App. No.
13/790,803
Granted
Mar 10, 2015
Kind
B2
Abstract

A high-frequency transmission line having low alternate current (AC) resistance is provided. One aspect of the present invention is a high-frequency transmission line disposed along a surface of an insulating support, wherein, letting F [Hz] be the frequency of an AC electric signal transmitted by the high-frequency transmission line and Ms [Wb/m] be the saturation magnetization per unit area, the frequency value F and the saturation magnification value per unit area Ms satisfy the following expression (1): Ms ≦(1.5×10 2 )/ F +5.7×10 −8   (1).

Claims (22)

1. A high-frequency transmission line disposed along a surface of an insulating support;

wherein, letting F [Hz] be the frequency of an alternate current electric signal transmitted by the high-frequency transmission line, and

Ms [Wb/m] be the saturation magnetization per unit area of the high-frequency transmission line,

the frequency value F and the saturation magnification value per unit area Ms satisfy the following expression (1):

Ms ≦(1.5×10 2 )/ F+ 5.7×10 −8   (1).

2. A high-frequency transmission line according to claim 1 , comprising:

a conductor layer disposed on the surface of the insulating support; and

a coating layer covering a surface of the conductor layer.

3. A high-frequency transmission line according to claim 2 , wherein the coating layer contains at least one of nickel and palladium.

4. A high-frequency transmission line according to claim 3 , wherein the coating layer contains nickel;

wherein the coating layer is formed by electroless plating; and

wherein a plating solution used for the electroless plating contains at least one complexing agent selected from the group consisting of carboxylic acids, dicarboxylic acids, hydroxy acids, and amino acids and elemental nickel.

5. A high-frequency transmission line according to claim 3 , wherein the coating layer contains elemental phosphorus.

6. A high-frequency transmission line according to claim 4 , wherein the plating solution contains phosphorus.

7. An antenna comprising the high-frequency transmission line according to one of claim 1 .

8. An antenna comprising the high-frequency transmission line according to one of claim 2 .

9. An antenna comprising the high-frequency transmission line according to one of claim 3 .

10. An antenna comprising the high-frequency transmission line according to one of claim 5 .

11. An electronic circuit board comprising the high-frequency transmission line according to one of claim 1 .

12. An electronic circuit board comprising the high-frequency transmission line according to one of claim 2 .

13. An electronic circuit board comprising the high-frequency transmission line according to one of claim 3 .

14. An electronic circuit board comprising the high-frequency transmission line according to one of claim 5 .

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 12, 2013
From: TDK CORPORATION
To: TDK CORPORATION
Reel/Frame 030651/0687 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2013
From: YOSHIDA, KENICHI; HORIKAWA, YUHEI
To: TDK CORPORATION
Reel/Frame 030082/0278 →