IP Library Granted Patent US 8,897,074
Granted Patent B2
US 8,897,074 · App. 13/791,068 · Granted Nov 25, 2014

Writing data to a thermally sensitive memory device

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Quick Facts
Patent No.
US 8,897,074
App. No.
13/791,068
Granted
Nov 25, 2014
Kind
B2
Abstract

Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device.

Claims (24)

1. An apparatus for writing data to a thermally sensitive memory device, the apparatus comprising a computer processor, a computer memory operatively coupled to the computer processor, the computer memory having disposed within it computer program instructions that, when executed by the computer processor, cause the apparatus to carry out the steps of:

receiving a physical layout of the thermally sensitive memory device; wherein the thermally sensitive memory device includes a plurality of memory modules;

receiving the direction of airflow across the thermally sensitive memory device;

selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device including selecting from the plurality of memory modules of the thermally sensitive memory device, a particular memory module that is downwind of all of the other memory modules in the plurality of memory modules; and

writing data to the selected address of the thermally sensitive memory device.

2. The apparatus of claim 1 wherein the physical layout of the thermally sensitive memory device identifies the location of flash memory modules on the thermally sensitive memory device.

3. The apparatus of claim 1 wherein the physical layout of the thermally sensitive memory device identifies the location of a memory controller on the thermally sensitive memory device.

4. The apparatus of claim 1 further comprising computer program instructions that, when executed by the computer processor, cause the apparatus to carry out the step of:

determining a write rate for the thermally sensitive memory device; and

wherein selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device includes selecting one or more flash memory modules for writing data to the thermally sensitive memory device in dependence upon the write rate for the thermally sensitive memory device.

5. The apparatus of claim 1 wherein the thermally sensitive memory device includes flash memory.

6. A computer program product for writing data to a thermally sensitive memory device, the computer program product disposed upon a computer readable medium, the computer program product comprising computer program instructions that, when executed, cause a computer to carry out the steps of:

receiving a physical layout of the thermally sensitive memory device; wherein the thermally sensitive memory device includes a plurality of memory modules;

receiving the direction of airflow across the thermally sensitive memory device;

selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device including selecting from the plurality of memory modules of the thermally sensitive memory device, a particular memory module that is downwind of all of the other memory modules in the plurality of memory modules; and

writing data to the selected address of the thermally sensitive memory device.

7. The computer program product of claim 6 wherein the physical layout of the thermally sensitive memory device identifies the location of flash memory modules on the thermally sensitive memory device.

8. The computer program product of claim 6 wherein the physical layout of the thermally sensitive memory device identifies the location of a memory controller on the thermally sensitive memory device.

9. The computer program product of claim 6 further comprising computer program instructions that, when executed, cause the computer to carry out the step of:

determining a write rate for the thermally sensitive memory device; and

wherein selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device includes selecting one or more flash memory modules for writing data to the thermally sensitive memory device in dependence upon the write rate for the thermally sensitive memory device.

10. The computer program product of claim 6 wherein the thermally sensitive memory device includes flash memory.

11. The computer program product of claim 6 wherein the computer readable medium comprises a signal medium.

12. The computer program product of claim 6 wherein the computer readable medium comprises a storage medium.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050300/0570 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT CONTAINING TYPO ERRORS PREVIOUSLY RECORDED AT REEL: 037101 FRAME: 0969. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 28, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037689/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037101/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2013
From: CUDAK, GARY D.; DO, LYDIA M.; HARDEE, CHRISTOPHER J.; ROBERTS, ADAM
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 029954/0668 →