IGBT with buried emitter electrode
View Patent ↗There are disclosed herein various implementations of an insulated gate bipolar transistor (IGBT) with buried emitter electrodes. Such an IGBT may include a collector at a bottom surface of a semiconductor substrate, a drift region having a first conductivity type situated over the collector, and a base layer having a second conductivity type opposite the first conductivity type situated over the drift region. In addition, such an IGBT may include deep insulated trenches extending from a semiconductor surface above the base layer, into the drift region, each of the deep insulated trenches having a buried emitter electrode disposed therein. The IGBT may further include an active cell including an emitter, a gate trench with a gate electrode disposed therein, and an implant zone situated, between adjacent deep insulated trenches. The implant zone is formed below the base layer and has the first conductivity type.
1. An insulated-gate bipolar transistor (IGBT) in a semiconductor substrate, said IGBT comprising:
a collector at a bottom surface of said semiconductor substrate, a drift region having a first conductivity type situated over said collector, and a base layer having a second conductivity type opposite said first conductivity type situated over said drift region;
a plurality of deep insulated trenches extending from a semiconductor surface above said base layer, into said drift region, each of said deep insulated trenches having a buried emitter electrode disposed therein;
an active cell including an emitter, a gate trench with gate electrode disposed therein, and an implant zone, situated between adjacent deep insulated trenches that are substantially deeper than said gate trench;
said implant zone being formed below said base layer and having said first conductivity type.
2. The IGBT of claim 1 , wherein said buried emitter electrode comprises doped polysilicon.
3. The IGBT of claim 1 , further comprising a dummy cell neighboring said active cell, wherein said implant zone does not extend to said dummy cell, and wherein said base layer extends to said dummy cell.
4. The IGBT of claim 1 , further comprising a buffer layer of said first conductivity type formed between said drift region and said collector.
5. An insulated-gate bipolar transistor (IGBT) in a semiconductor substrate, said IGBT comprising:
a collector at a bottom surface of said semiconductor substrate, a drift region having a first conductivity type situated over said collector, and a base layer having a second conductivity type opposite said first conductivity type situated over said drift region;
an active cell including an emitter, a gate trench with gate electrode disposed therein, and an implant zone having said first conductivity type, situated between adjacent deep insulated trenches;
a dummy cell neighboring said active cell, said implant zone not extending to said dummy cell;
each of said adjacent deep insulated trenches being substantially deeper than said gate trench and having a buried emitter electrode disposed therein.
6. The IGBT of claim 5 , wherein said buried emitter electrode comprises doped polysilicon.
7. The IGBT of claim 5 , wherein said dummy cell includes at least one deep insulated trench with a respective buried emitter electrode disposed therein.
8. The IGBT of claim 5 , wherein said base layer extends to said dummy cell.
9. The IGBT of claim 5 , further comprising a buffer layer having said first conductivity type formed between said drift region and said collector.