IP Library Granted Patent US 8,988,944
Granted Patent B2
US 8,988,944 · App. 13/792,550 · Granted Mar 24, 2015

Writing data to a thermally sensitive memory device

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Quick Facts
Patent No.
US 8,988,944
App. No.
13/792,550
Granted
Mar 24, 2015
Kind
B2
Abstract

Writing data to a thermally sensitive memory device, including: receiving a physical layout of the thermally sensitive memory device; receiving the direction of airflow across the thermally sensitive memory device; selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device; and writing data to the selected address of the thermally sensitive memory device.

Claims (11)

1. A method of writing data to a thermally sensitive memory device, the method comprising:

receiving a physical layout of the thermally sensitive memory device; wherein the thermally sensitive memory device includes a plurality of memory modules;

receiving the direction of airflow across the thermally sensitive memory device;

selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device including selecting from the plurality of memory modules of the thermally sensitive memory device, a particular memory module that is downwind of all of the other memory modules in the plurality of memory modules; and

writing data to the selected address of the thermally sensitive memory device.

2. The method of claim 1 wherein the physical layout of the thermally sensitive memory device identifies the location of flash memory modules on the thermally sensitive memory device.

3. The method of claim 1 wherein the physical layout of the thermally sensitive memory device identifies the location of a memory controller on the thermally sensitive memory device.

4. The method of claim 1 further comprising:

determining a write rate for the thermally sensitive memory device; and

wherein selecting an address for writing data to the thermally sensitive memory device in dependence upon the physical layout of the thermally sensitive memory device and the direction of airflow across the thermally sensitive memory device includes selecting one or more flash memory modules for writing data to the thermally sensitive memory device in dependence upon the write rate for the thermally sensitive memory device.

5. The method of claim 1 wherein the thermally sensitive memory device includes flash memory.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050300/0721 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT CONTAINING TYPO ERRORS PREVIOUSLY RECORDED AT REEL: 037101 FRAME: 0969. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 28, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037689/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037101/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2013
From: CUDAK, GARY D.; DO, LYDIA M.; HARDEE, CHRISTOPHER J.; ROBERTS, ADAM
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 029960/0262 →