Spread-spectrum MEMS self-test system and method
View Patent ↗A MEMS sensor includes a micro-electromechanical structure, a detection circuit, and a self-test circuit to test the health of the MEMS sensor during runtime operations. The self-test circuit is configured to inject into the micro-electromechanical structure a plurality of injected test signals that are broad-band frequency-varying frequency signals, which are based on spread spectrum based modulation. The injected test signals may a magnitude that is below an observable threshold of the sensor signal as well as a test-signal bandwidth that overlaps with a substantial portion of the sensor bandwidth, including the stimulus of interest.
1. A MEMS sensor having a runtime self-test circuit, the MEMS sensor comprising:
a micro-electromechanical device that outputs, during runtime operation, a device output signal;
a detection circuit configured to detect, during the runtime operation of the micro-electromechanical device, a stimulus produced by the micro-electromechanical system in a sensor bandwidth of the device output signal, the stimulus having a magnitude above a predetermined detection threshold of the detection circuit, the detection circuit further configured to produce a sensor output signal based on the detected stimulus; and
a self-test circuit configured to:
inject, during the runtime operation of the micro-electromechanical device, a self-test signal into a signal path of the micro-electromechanical device including a MEMS structure involved with generation of the stimulus in the sensor bandwidth of the device output signal, wherein the self-test signal is a spread-spectrum signal having a test-signal bandwidth that overlaps at least a portion of the sensor bandwidth;
detect a test signal component in the test-signal bandwidth of the device output signal based on a reference test signal corresponding to the injected self-test signal, the test signal component have a magnitude below the detection threshold of the detection circuit; and
produce a test output signal indicating a status for the micro-electromechanical system based on the test signal component and the reference test signal.
2. A MEMS sensor according to claim 1 , wherein the self-test circuit is configured to continuously inject the self-test signal into the micro-electromechanical device during the runtime operation of the micro-electromechanical device.
3. A MEMS sensor according to claim 1 , wherein the self-test circuit comprises:
a pseudo-random number sequence source configured to provide a pseudo-random number sequence; and
a modulation circuit configured to modulate the pseudo-random number sequence and a self-test magnitude reference to produce a modulated signal and to inject the modulated signal into the micro-electromechanical device.
4. A MEMS sensor according to claim 3 , wherein at least one of:
the self-test magnitude reference is a constant direct-current (DC) source;
the pseudo-random number sequence source comprises a pseudo-random number generator;
the pseudo-random number sequence source comprises a memory in which is stored the pseudo-random number sequence;
the bandwidth of the self-test signal is equal to the sensor bandwidth;
the bandwidth of the self-test signal is less than the sensor bandwidth;
the bandwidth of the self-test signal is greater than the sensor bandwidth;
the bandwidth of the self-test signal extends below the sensor bandwidth; or
the bandwidth of the self-test signal extends above the sensor bandwidth.
5. A MEMS sensor according to claim 3 , wherein the self-test circuit further comprises:
a demodulation circuit configured to detect the test signal component by demodulating the device output signal with the reference test signal in-phase with test signal component.
6. A MEMS sensor according to claim 5 , wherein at least one of:
the self-test circuit further comprises a low-pass filter to extract the test signal component from the device output signal;
the self-test circuit further comprises a delay circuit to produce the reference test signal in-phase with the test signal component;
the self-test circuit further comprises a memory to provide the reference test signal; or
the demodulation circuit comprises a multiplier to combine the test signal component with the in-phase reference test signal.
7. A MEMS sensor according to claim 1 , wherein the self-test circuit is configured to detect the test signal component in the test-signal bandwidth of the device output by:
(i) correlating the sensor signal with the pseudo-random number sequence in phase with the sensor signal to produce a correlation signal; and
(ii) comparing the correlation signal to at least one of a pre-defined correlation threshold or a pre-defined signal energy threshold.
8. A MEMS sensor according to claim 7 , wherein the pre-defined energy threshold is established based on the relationship:
fc*STM 2
wherein fc is a frequency value of the injected self-test test signal and STM is an average power of a period spread of the injected self-test signal.
9. A MEMS sensor according to claim 1 , wherein the self-test circuit is configured to inject the self-test signal according to at least one of a frequency-hopping spread spectrum modulation, a direct-sequence spread spectrum (DSSS) modulation, a time-hopping spread spectrum modulation, or a chirp spread spectrum modulation.
10. A MEMS sensor according to claim 1 , wherein the micro-electromechanical device includes at least one of:
an inertial sensor;
a sound sensor; or
a pressure sensor.
11. A self-test circuit for a micro-electromechanical system that outputs, during runtime operation, a device output signal including a stimulus in a sensor bandwidth of the device output signal, the stimulus having a magnitude above a predetermined detection threshold, the self-test circuit comprising:
a self-test signal generator configured to inject, during runtime operation of the micro-electromechanical device, a self-test signal into a signal path of the micro-electromechanical device including a MEMS structure involved with generation of the stimulus in a sensor bandwidth of the device output signal, wherein the self-test signal is a spread-spectrum signal having a test-signal bandwidth that overlaps at least a portion of the sensor bandwidth;
a self-test signal detector configured to detect a test signal component in the test-signal bandwidth of the device output signal based on a reference test signal corresponding to the injected self-test signal, the test signal component have a magnitude below the detection threshold of the detection circuit; and
a controller configured to produce a test output signal based on the detected test signal component.
12. A self-test circuit according to claim 11 , wherein the self-test signal generator is configured to continuously inject the self-test signal into the micro-electromechanical device during the runtime operation of the micro-electromechanical device.
13. A self-test circuit according to claim 11 , wherein the self-test signal generator comprises:
a pseudo-random number sequence source configured to provide a pseudo-random number sequence; and
a modulation circuit configured to modulate the pseudo-random number sequence and a self-test magnitude reference to produce a modulated signal and to inject the modulated signal into the micro-electromechanical device.
14. A self-test circuit according to claim 13 , wherein at least one of:
the self-test magnitude reference is a constant direct-current (DC) source;
the pseudo-random number sequence source comprises a pseudo-random number generator;
the pseudo-random number sequence source comprises a memory in which is stored the pseudo-random number sequence;
the bandwidth of the self-test signal is equal to the sensor bandwidth;
the bandwidth of the self-test signal is less than the sensor bandwidth;
the bandwidth of the self-test signal is greater than the sensor bandwidth;
the bandwidth of the self-test signal extends below the sensor bandwidth; or
the bandwidth of the self-test signal extends above the sensor bandwidth.
15. A self-test circuit according to claim 11 , wherein the self-test signal detector comprises:
a demodulation circuit configured to detect the test signal component by demodulating the device output signal with the reference test signal in-phase with test signal component.
16. A self-test circuit according to claim 15 , wherein at least one of:
the self-test signal detector comprises a low-pass filter to extract the test signal component from the device output signal;
the self-test signal detector comprises a delay circuit to produce the reference test signal in-phase with the test signal component;
the self-test signal detector comprises a memory to provide the reference test signal; or
the demodulation circuit comprises a multiplier to combine the test signal component with the in-phase reference test signal.
17. A self-test circuit according to claim 11 , wherein the self-test signal detector is configured to detect the test signal component in the test-signal bandwidth of the device output by:
(i) correlating the sensor signal with the pseudo-random number sequence in phase with the sensor signal to produce a correlation signal; and
(ii) comparing the correlation signal to at least one of a pre-defined correlation threshold or a pre-defined signal energy threshold.
18. A self-test circuit according to claim 17 , wherein the pre-defined energy threshold is established based on the relationship:
fc*STM 2
wherein fc is a frequency value of the injected self-test test signal and STM is an average power of a period spread of the injected self-test signal.
19. A self-test circuit according to claim 11 , wherein the self-test circuit is configured to inject the self-test signal according to at least one of a frequency-hopping spread spectrum modulation, a direct-sequence spread spectrum (DSSS) modulation, a time-hopping spread spectrum modulation, or a chirp spread spectrum modulation.
20. A method of evaluating the status of a MEMS sensor during runtime, the MEMS sensor having a micro-electromechanical device that outputs, during a runtime operation, a device output signal, the MEMS sensor further having a detection circuit configured to detect, during the runtime operation of the micro-electromechanical device, a stimulus produced by the micro-electromechanical system in a sensor bandwidth of the device output signal, the stimulus having a magnitude above a predetermined detection threshold of the detection circuit, the detection circuit further configured to produce a sensor output signal based on the detected stimulus, the method comprising:
injecting, during runtime operation of the micro-electromechanical device, a self-test signal into a signal path of the micro-electromechanical device including a MEMS structure involved with generation of a stimulus in a sensor bandwidth of a device output signal, wherein the self-test signal is a spread-spectrum signal having a test-signal bandwidth that overlaps at least a portion of the sensor bandwidth;
detecting a test signal component in the test-signal bandwidth of the device output signal based on a reference test signal corresponding to the injected self-test signal, the test signal component have a magnitude below the detection threshold of the detection circuit; and
producing a test output signal based on the detected test signal component.