IP Library Granted Patent US 9,224,534
Granted Patent B2
US 9,224,534 · App. 13/794,932 · Granted Dec 29, 2015

Electromagnetic resonance coupler

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Quick Facts
Patent No.
US 9,224,534
App. No.
13/794,932
Granted
Dec 29, 2015
Kind
B2
Abstract

The electromagnetic resonance coupler includes: a transmission substrate; a reflective substrate; the first resonant wiring having an open loop shape having a first opening; a first input/output wiring connected to the first resonant wiring; the second resonant wiring provided inside the first resonant wiring and having an open loop shape having a second opening; a second input/output wiring connected to the second resonant wiring, the first resonant wiring, the first input/output wiring, the second resonant wiring, and the second input/output wiring being provided on the transmission substrate; and a reflection wiring provided on the reflective substrate and having a open loop shape having a third opening, in which, when viewed in a direction perpendicular to a main face of the transmission substrate, the reflection wiring and the first resonant wiring overlap and the reflection wiring and the second resonant wiring overlap.

Claims (63)

1. An electromagnetic resonance coupler for contactlessly transmitting a high frequency signal between a first resonant wiring and a second resonant wiring, the electromagnetic resonance coupler comprising:

a transmission substrate;

a reflective substrate facing the transmission substrate;

the first resonant wiring having an open loop shape having a first opening;

a first input/output wiring connected to the first resonant wiring;

the second resonant wiring provided inside the first resonant wiring and having an open loop shape having a second opening;

a second input/output wiring connected to the second resonant wiring, the first resonant wiring, the first input/output wiring, the second resonant wiring, and the second input/output wiring being provided on the transmission substrate; and

a reflection wiring provided on the reflective substrate and having a open loop shape having a third opening,

wherein, when viewed in a direction perpendicular to a main face of the transmission substrate,

an overlapping portion of the reflection wiring and the first resonant wiring has an open loop shape having the first opening and the third opening, and

an overlapping portion of the reflection wiring and the second resonant wiring has an open loop shape having the second opening and the third opening.

2. The electromagnetic resonance coupler according to claim 1 ,

wherein the reflection wiring has a fourth opening and a fifth opening as the third opening,

the reflection wiring including:

a first reflection wiring having an open loop shape having the fourth opening;

a second reflection wiring provided inside the first reflection wiring and having an open loop shape having the fifth opening; and

a connection wiring for connecting the first reflection wiring and the second reflection wiring, and

when viewed in the direction perpendicular to the main face of the transmission substrate,

an overlapping portion of the first reflection wiring and the first resonant wiring has an open loop shape having the first opening and the fourth opening, and

an overlapping portion of the second reflection wiring and the second resonant wiring has an open loop shape having the second opening and the fifth opening.

3. The electromagnetic resonance coupler according to claim 1 ,

wherein the second resonant wiring has a wiring width less than a wiring width of the first resonant wiring.

4. The electromagnetic resonance coupler according to claim 2 ,

wherein the second refection wiring has a wiring width less than a wiring width of the first reflection wiring.

5. The electromagnetic resonance coupler according to claim 2 ,

wherein the first reflection wiring has the same wiring width and shape as the first resonant wiring,

the second reflection wiring has the same wiring width and shape as the second resonant wiring,

when viewed in the direction perpendicular to the main face of the transmission substrate,

contours of the first reflection wiring and the first resonant wiring match, and

contours of the second reflection wiring and the second resonant wiring match.

6. The electromagnetic resonance coupler according to claim 1 ,

wherein a distance from the first resonant wiring or the second resonant wiring to the reflection wiring in the direction perpendicular to the main face of the transmission substrate is less than or equal to one half a wavelength of the high frequency signal.

7. The electromagnetic resonance coupler according to claim 2 ,

wherein the first resonant wiring, the second resonant wiring, the first reflection wiring, and the second reflection wiring have a circular or rectangular contour.

8. The electromagnetic resonance coupler according to claim 1 , further comprising:

a cover substrate facing the reflection substrate; and

a cover ground wiring provided on a surface of the cover substrate which does not face the reflective substrate, the cover ground wiring indicating a reference potential of the high frequency signal.

9. The electromagnetic resonance coupler according to claim 1 , further comprising

a coplanar ground wiring provided in the vicinity of the second resonant wiring, the first input/output wiring, and the second input/output wiring on the transmission substrate, the coplanar ground wiring indicating a reference potential of the high frequency signal.

10. The electromagnetic resonance coupler according to claim 9 ,

wherein the coplanar ground wiring includes:

a first coplanar ground wiring provided along the first input/output wiring; and

a second coplanar ground wiring provided along the second input/output wiring, and insulated from the first coplanar ground wiring.

11. The electromagnetic resonance coupler according to claim 1 , further comprising

a back face ground wiring provided on a back that is a surface of the transmission substrate on which the first resonant wiring is not formed, the back face ground wiring indicating a reference potential of the high frequency signal.

12. The electromagnetic resonance coupler according to claim 11 ,

wherein, when viewed in the direction perpendicular to the main face of the transmission substrate, the back face ground wiring includes:

a first back face ground wiring in an area outside contours of the second resonant wring and the second input/output wiring; and

a second back face ground wiring in an area surrounded by the contours of the second resonant wiring and the second input/output wiring, and

the first back face ground wiring is insulated from the second back face ground wiring through an insulation pattern provided along the contours of the second resonant wiring and the second input/output wiring.

13. The electromagnetic resonance coupler according to claim 1 , further comprising on the transmission substrate:

a transmission circuit for modulating a control signal using the high frequency signal; and

a reception circuit for demodulating the control signal,

wherein the modulated control signal is transmitted between the first resonant wiring and the second resonant wiring.

14. The electromagnetic resonance coupler according to claim 13 ,

wherein the transmission circuit includes:

an oscillator for outputting the high frequency signal; and

a signal mixer for mixing the high frequency signal outputted by the oscillator and the control signal to modulate the control signal using the high frequency signal, and

the reception circuit demodulates the modulated control signal using a diode and a capacitor.

15. The electromagnetic resonance coupler according to claim 13 ,

wherein a switching element is formed on the transmission substrate, the switching element being brought to on or off with the control signal demodulated by the reception circuit.

16. The electromagnetic resonance coupler according to claim 1 ,

wherein the transmission substrate is a nitride semiconductor substrate or a substrate on which a nitride semiconductor is formed.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2014
From: NAGAI, SHUICHI; UEDA, DAISUKE
To: PANASONIC CORPORATION
Reel/Frame 032046/0542 →