Granted Patent B2

US 10,421,208 · App. 13/795,896 · Granted Sep 24, 2019

Abstract

Claims (69)

1. A method for cleaving wafers, the method comprising:

providing a slice of a crystalline material, said slice having at least a first plane side;

providing at least one stressing means to be attached to said slice, said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion (CTE) different from that of the slice, and the at least one stressing means comprising a stressing layer formed as one of a perforated structure and a meshlike structure;

attaching said at least one stressing means to said first plane side of said slice to form a stack;

applying a notch to said slice;

cooling down said stack to induce a thermal shear stress to said slice; and

applying a pulling force to said slice in a direction perpendicular to said first plane side via said at least one stressing means during the cooling down of said stack.

2. The method according to claim 1 , wherein the stressing layer is permeable for at least one of light and a chemical.

3. The method according to claim 1 , wherein

said at least one stressing means and a portion of said slice are moved in a vertical direction to generate the pulling force applied to said slice to detach said portion from said slice,

said vertical direction being perpendicular to said first plane side, and

said at least one stressing means is at least in part made of at least one of the following materials: silver, aluminum, zinc, gallium, copper, manganese and their compounds, steel, and plastic.

4. The method according to claim 1 , wherein

said pulling force applied to said slice is produced by moving said at least one stressing means in an upward direction,

said upward direction being perpendicular to said first plane side, and

the material has a CTE of at least 5 ppm/K.

5. The method according to claim 1 , wherein

said at least one stressing means is moved in a vertical direction to produce said pulling force applied on said slice,

said vertical direction being perpendicular to said first plane side,

said at least one stressing means is bonded to said slice by means of one of the following bonding agents: glue, wax, resin and freezing liquid, and

said slice and said at least one stressing means are cooled to a temperature below a bonding temperature of said bonding agent.

6. The method according to claim 1 , wherein said stack is cooled to minus forty degrees Celsius.

7. The method according to claim 1 , wherein

the at least one stressing means comprises a coating being applied to said first plane side of said slice, and

the pulling force is applied to said slice by moving the at least one stressing means in the direction perpendicular to the first plane side.

8. The method according to claim 1 , wherein said stressing means comprises a handle and the pulling force is applied to the slice by applying a mechanical force to said handle.

9. The method according to claim 1 , wherein the slice has one of a cylindrical and a cuboid shape with a thickness in the range of 1 mm to 50 mm.

10. The method according to claim 1 , wherein the slice has at least a second plane side lying opposite to said first plane side and a holding means is attached to said second plane side.

11. The method according to claim 1 , wherein a plurality of slices is processed in parallel.

12. The method according to claim 1 , wherein the at least one stressing means and a wafer are removed from said slice after said stack has cooled down.

13. The method according to claim 1 , wherein a crystalline wafer cleaved from said slice is removed from the at least one stressing means by decomposing a bonding layer.

14. The method according to claim 1 , wherein the slice is cut from a silicon ingot.

15. The method according to claim 1 , wherein a cleaved wafer has a thickness in a range of 50 μm to 500 μm.

16. The method according to claim 1 , wherein a cleaved wafer has a thickness in a range of 100 μm to 300 μm.

17. The method according to claim 1 , wherein said notch is applied to said slice after cooling down said stack.

18. The method according to claim 1 , wherein said one of said perforated structure and said meshlike structure is a mesh component having a plurality of mesh openings.

19. A method for cleaving wafers, the method comprising:

providing a slice of a crystalline material, said slice having at least a first plane side;

providing at least one stressing means to be attached to said slice, a portion of said at least one stressing means comprising a material with a coefficient of thermal expansion (CTE) different from a CTE of the slice, said at least one stressing means comprising a stressing layer, and said stressing layer comprising one of a perforated structure and a mesh structure;

attaching said at least one stressing means to said first plane side of said slice to form a stack;

applying a notch to said slice;

cooling down said stack to induce a thermal shear stress to said slice; and

applying a pulling force to said stack in a direction perpendicular to said first plane side via said at least one stressing means during the cooling of said stack such that a portion of said slice is detached from another portion of said slice to form a wafer.

20. A method for cleaving wafers, the method comprising:

providing a slice of a crystalline material, said slice having at least a first plane side;

providing at least one stressing means to be attached to said slice, a portion of said at least one stressing means comprising a material with a coefficient of thermal expansion (CTE) different from a CTE of the slice, said at least one stressing means comprising a stressing layer, and said stressing layer comprising one of a perforated structure and a mesh structure;

connecting said at least one stressing means to said first plane side of said slice to form a stack;

applying a notch to said slice;

cooling said stack to induce a thermal shear stress to said slice; and

applying a pulling force to said stack in a direction perpendicular to said first plane side during the cooling of said slice by moving said at least one stressing means and a portion of said slice detachably connected to said at least one stressing means in an upward direction such that said portion of said slice is detached from another portion of said slice to form a wafer.

21. The method according to claim 20 , wherein said at least one stressing means is cooled with said at least one stressing means connected to said slice to provide a cooled stack.

22. The method according to claim 21 , wherein

said at least one stressing means is bonded to said slice via a bonding agent,

said slice and said at least one stressing means cooled to a temperature below a bonding temperature of said bonding agent, and

said wafer has a thickness in a range of 50 μm to 500 μm.

23. A method for cleaving wafers, the method comprising;

providing a slice of a crystalline material, said slice having at least a first plane side;

providing at least one stressing means to be attached to said slice, a portion of said at least one stressing means comprising a material with a coefficient of thermal expansion (CTE) different from a CTE of the slice, said at least one stressing means comprising a stressing a layer, and said stressing layer comprising one of a perforated structure and a mesh structure;

attaching said at least one stressing means to said first plane side of said slice to form a stack;

cooling said stack to induce a thermal shear stress to said slice;

applying a notch to said slice after the cooling of said stack; and

applying a pulling force to said cooled stack in a direction perpendicular to said first plane side via said at least one stressing means during the cooling of said stack, such that a portion of said slice is detached from another portion of said slice to form a wafer.

24. A method for cleaving wafers, the method comprising:

providing a slice of a crystalline material, said slice having at least a first plane side;

providing at least one stressing means to be attached to said slice, a portion of said at least one stressing means comprising a material with a coefficient of thermal expansion (CTE) different from a CTE of the slice, said at least one stressing means comprising a stressing layer, and said stressing layer comprising a mesh structure;

attaching said at least one stressing means to said first plane side of said slice to form a stack;

applying a notch to said slice;

cooling said stack to induce a thermal shear stress to said slice; and

applying a pulling force to said stack via said at least one stressing means, said Dulling force being in a direction perpendicular to the first plane side, such that a portion of said slice is detached from another portion of said slice to form a wafer.

Assignments (10)