Semiconductor device with high voltage transistor

1. A method for manufacturing a semiconductor device comprising:

forming an active region of a first conductivity type in a semiconductor substrate;

forming a channel region of said first conductivity type in a portion of said active region;

forming a first drain region of a second conductivity type opposite to said first conductivity type, the channel region and the first drain region partially overlapping to form an overlapped portion;

forming a gate electrode covering the overlapped portion;

after said gate electrode is formed, implanting second impurity ions of said second conductivity type into said active region by using said gate electrode as a mask;

after implanting the second impurity ions, forming an insulating film covering a side wall of said gate electrode and a portion of said first drain region; and

implanting first impurity ions of said second conductivity type into said active region, by using said gate electrode and said insulating film as a mask.

2. A method for manufacturing a semiconductor device comprising:

forming an isolation region in a semiconductor substrate, the isolation region defining first, second and third active regions;

implanting first impurity ions of a first conductivity type into said first, second and third active region to form first, second and third wells, respectively;

masking said third active region and a portion of said first active region, and implanting second impurity ions of said first conductivity type into said first and second active regions to form first and second channel regions, respectively;

implanting third impurity ions of a second conductivity type opposite to said first conductivity type into said first active region to form a first drain region, in such a manner that a portion of said first channel region is overlapped with said first drain region;

forming first, second and third gate electrodes above said first, second and third active regions, respectively, said first gate electrode superposing a portion of said first drain region and covering one lateral end of said first channel region;

forming first insulating side wall spacers on side walls of said second and third gate electrodes above said second and third active regions, respectively, and forming a second insulating side wall spacer on a side wall of said first gate electrode on a source side, and forming an insulating film extending from above a drain-side region of said first gate electrode to a location above said first drain region; and

implanting fourth impurity ions of said second conductivity type into said first, second and third active regions to form second drain/source regions.

3. The method for manufacturing a semiconductor device according to claim 2 , further comprising, after said first, second and third gate electrodes are formed, masking said third active region and a portion of said first active region on a drain side, and implanting fifth impurity ions of said second conductivity type to form extension regions.

4. The method for manufacturing a semiconductor device according to claim 2 , further comprising, after said first, second and third gate electrodes are formed, masking said third active region, and implanting sixth impurity ions of said second conductivity type into said first active region and said second active region to form extension regions.