Chip on submount carrier fixture
View Patent ↗Heat assisted magnetic recording uses a laser diode (LD) to provide energy during the writing process. The LD is bonded on a submount chip which is referred to as the Chip-On-Submount-Assembly (COSA). COSA devices undergo burn-in and testing in COSA burn-in fixtures, which include a first non-conductive layer having through holes and a second conductive layer having first openings. The second conductive layer is disposed over the first non-conductive layer with each of the first openings overlaying one of the through holes. COSA burn-in fixtures also include a third non-conductive layer having second openings that are larger than the first openings. The third non-conductive layer is disposed over the second conductive layer with each of the second openings overlaying one of the first openings, which forms pockets with a seat on the conductive layer for disposing the LD with one electrode in contact with the conductive layer.
1. A chip-on-submount-assembly (COSA) testing system comprising:
a first non-conductive layer having a plurality of through holes and a first alignment pin hole pair;
a second conductive layer having a plurality of first openings and a second alignment pin hole pair, the second conductive layer being disposed over the first non-conductive layer with each of the plurality of first openings overlaying one of the plurality of through holes; and
a third non-conductive layer having a third alignment pin hole pair and a plurality of second openings that are larger than the plurality of first openings, the third non-conductive layer being disposed over the second conductive layer with each of the plurality of second openings overlaying one of the plurality of first openings; and
a pair of alignment pins positioned through the first alignment pin hole pair, second alignment pin hole pair, and third alignment pin hole pair,
wherein the plurality of first openings and the plurality of second openings form a plurality of pockets with a seat on the second conductive layer.
2. The system of claim 1 further comprising a plurality of third opening in the first non-conductive layer, each of the third openings extending from an edge of the first conductive layer to one of the through holes.
3. The system of claim 1 wherein the diameters of the first openings are larger than the diameters of the through holes.
4. The system of claim 1 wherein each of the plurality of through holes is centered with respect to each of the plurality of first openings.
5. The system of claim 1 wherein each of the plurality of through holes is centered with respect to each of the plurality of first openings and each of the plurality of second openings is centered with respect to each of the plurality of first openings.