RFID inlay incorporating a ground plane

1. An RFID inlay, comprising:

a substrate having a first area and a second area;

a conductive structure having a first part disposed over at least a portion of the first area and a second part disposed over at least a portion of the second area; and

a dielectric material disposed over at least a portion of the conductive structure;

wherein the inlay is provided in a flat configuration and is adapted to be folded such that the first part of the conductive structure is disposed over the second part of the conductive structure and the dielectric material is disposed between the first part and the second part and the first part of the conductive structure is capacitively coupled to the second part of the conductive structure.

2. The RFID inlay of claim 1 , further comprising a transfer tape disposed over one of the first and second areas.

3. The RFID inlay of claim 1 , wherein transverse edges of each of the first and second parts are in alignment with one another and longitudinal edges of the first and second portions are not in alignment with one another.

4. The RFID inlay of claim 1 , wherein the dielectric layer is a foam and has a thickness of about 0.5 mm.

5. The RFID inlay of claim 1 , wherein the first part of the conductive structure comprises a radiating element.

6. The RFID inlay of claim 5 , wherein the radiating element is a monopole.

7. The RFID inlay of claim 1 , further comprising an overlaminate layer disposed between the conductive structure and the dielectric layer.

8. An RFID inlay, comprising:

a first substrate having a first conductive structure disposed thereon;

a second substrate having a second conductive structure disposed thereon, the second conductive structure having a first portion and at least one second portion wherein the first portion and the second portion of the second conductive structure are coupled by a bridge wherein the first portion of the second conductive structure comprises a radiating element such that the radiating element is a monopole; and

a dielectric layer disposed between the first conductive structure and the first portion of the second conductive structure;

wherein the at least one second portion of the second conductive structure is capacitively coupled to the first conductive structure.

9. The RFID inlay of claim 8 , the first conductive structure and the second conductive structure each further comprising a slot.

10. The RFID inlay of claim 8 , including a transfer tape applied over a portion of the dielectric layer.

11. The RFID inlay of claim 8 , further comprising an overlaminate layer disposed between the conductive structure and the dielectric layer.

12. An RFID inlay, comprising:

a substrate having a first surface and a second surface;

a plurality of cuts defined in the substrate so as to partition the substrate into a first area and a second area separable from the first area;

a plurality of hinges coupled to the first area and the second area;

a first conductive structure disposed on the first surface of the substrate and coextensive with the first area and at least a portion of the second area;

a second conductive structure disposed on the second surface of the substrate and coextensive with the first area wherein both the first and the second conductive structure have at least two tuning elements wherein a portion of the first conductive structure that is disposed on the first area is capacitively or conductively coupled to the second conductive structure.

13. The RFID inlay of claim 12 , wherein the second area is displaceable form the plane of the first area so as to introduce a dielectric separation between a portion of the first conductive structure that is disposed on the second area and the second conductive structure.

14. The RFID inlay of claim 12 , wherein a portion of the first conductive structure that is disposed on the second area comprises a radiating element.

15. The RFID inlay of claim 14 , wherein the radiating element is a monopole.