Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.
1. A light emitting device, comprising:
an LED chip;
a first lead having a top surface on which said LED chip is mounted, a side surface, and an uncovered bottom surface;
a first projection laterally protruding from the side surface of said first lead and attached to the top surface of said first lead;
a second lead having a top surface, a side surface, and an uncovered bottom surface, said first and second lead being arranged along a first direction in a plan view;
a second projection laterally protruding from the side surface of said second lead along a second direction perpendicular to the first direction in the plan view, a thickness of said second projection being smaller than that of said second lead at the side surface thereof;
a metal wire electrically connecting said LED chip and the top surface of said Second lead;
a sealing resin for completely covering said LED chip and said metal wire; and
an insulator provided so as to surround said first and second leads and provided between said first and second leads with a portion of the bottom surface of said first lead located right under said LED chip being uncovered.
2. The light emitting device of claim 1 , wherein
said first and second leads are formed of a lead frame.
3. The light emitting device of claim 1 , wherein
said metal wire is made of gold.
4. The light emitting device of claim 1 , wherein
said first and second leads include copper alloy.
5. The light emitting device of claim 1 , wherein
said first and second leads include copper and silver.
6. The light emitting device of claim 1 , wherein
said sealing resin is shaped like a dome.