Diamond-enhanced carbide cutting elements, drill bits using the same, and methods of manufacturing the same
View Patent ↗Embodiments for diamond-enhanced carbide cutting elements and drilling apparatuses that include a diamond-enhanced carbide material are disclosed. Embodiments of methods for manufacturing such articles are also disclosed. The diamond-enhanced carbide cutting elements disclosed are at least partially enclosed by a refractory metal structure from a refractory metal can assembly used in the fabrication of the diamond-enhanced carbide cutting element. The diamond-enhanced carbide cutting elements disclosed herein have greater abrasion resistance than tungsten carbide, and a greater toughness than polycrystalline diamond cutters.
1. A cutting element, comprising:
a substrate having a proximal portion and a distal portion, at least a portion of the substrate forms an exterior surface of the cutting element;
a sintered diamond-enhanced carbide (“DEC”) layer bonded to the distal portion of the substrate, the DEC layer including a plurality of diamond grains distributed in a cemented tungsten carbide constituent; and
a refractory metal structure bonded to at least part of the DEC layer;
wherein the cutting element includes an upper surface including at least one surface of the refractory metal structure and at least one surface of the DEC layer.
2. The cutting element of claim 1 wherein the DEC layer includes about 10 volume % to about 90 volume % diamond grains.
3. The cutting element of claim 1 wherein the DEC layer includes about 20 volume % to about 50 volume % diamond grains.
4. The cutting element of claim 1 wherein the DEC layer includes about 25 volume % to about 35 volume % diamond grains.
5. The cutting element of claim 1 wherein the refractory metal structure includes at least one refractory metal selected from the group consisting of niobium, tantalum, molybdenum, titanium, zirconium, and rhenium.
6. The cutting element of claim 1 wherein the cutting element exhibits greater toughness in a dog collar test as compared to a similarly configured cutting element have the refractory metal structure removed from the DEC layer.
7. The cutting element of claim 1 wherein the refractory metal structure is further bonded to a portion of the substrate.
8. The cutting element of claim 1 wherein the DEC layer has a thickness in a range of about 0.020 inch to about 0.080 inch.
9. The cutting element of claim 1 wherein the DEC layer has a thickness of about 0.0275 inch to about 0.040 inch.
10. The cutting element of claim 1 wherein the DEC layer exhibits a substantially uniform or non-uniform thickness.
11. A drilling apparatus, comprising:
a bit body; and
one or more cutting elements attached to the bit body, the one or more cutting elements including:
a substrate having a proximal portion and a distal portion, at least a portion of the substrate forms an exterior surface;
a sintered diamond-enhanced carbide (“DEC”) layer bonded to the distal portion of the substrate, the DEC layer including a plurality of diamond grains distributed in a cemented tungsten carbide constituent; and
a refractory metal structure bonded to at least part of the DEC layer;
wherein the cutting element includes an upper surface including at least one surface of the refractory metal structure and at least one surface of the DEC layer.
12. The drilling apparatus of claim 11 wherein the one or more cutting elements are press fit with or brazed to the bit body.
13. The drilling apparatus of claim 11 wherein the DEC layer includes about 25 volume % to about 35 volume % diamond grains.
14. The drilling apparatus of claim 11 wherein the refractory metal structure includes at least one refractory metal selected from the group consisting of niobium, tantalum, molybdenum, and rhenium.
15. The drilling apparatus of claim 11 wherein the refractory metal structure is further bonded to a portion of the substrate.
16. The drilling apparatus of claim 11 wherein the DEC layer has a thickness of about 0.0275 inch to about 0.040 inch.
17. The drilling apparatus of claim 11 wherein the bit body includes a plurality of roller cones on which the one or more cutting elements are mounted.
18. A method of making a cutting element, comprising:
providing a substrate having a proximal portion and a distal portion, and a volume of a carbide powder, wherein the carbide powder is intermixed with a plurality of diamond particles;
completely surrounding the substrate and the volume of the carbide powder within a refractory metal can assembly;
exposing the refractory metal can assembly containing the substrate and the volume of the carbide powder to a high-pressure, high-temperature (“HPHT”) process to form a sintered diamond-enhanced carbide (“DEC”) layer that is bonded to at least the distal portion of the substrate; and
removing a portion of the refractory metal can assembly from at least the proximal portion of the substrate such that at least a portion of the refractory metal can assembly remains bonded to at least part of the DEC layer.
19. The method of claim 18 wherein the carbide powder includes cobalt-cemented tungsten carbide particles and the plurality of diamond particles.
20. The method of claim 18 wherein the carbide powder includes about 25 volume % to about 35 volume % diamond particles.
21. The method of claim 18 wherein the DEC layer includes about 25 volume % to about 35 volume % diamond grains.
22. The method of claim 18 wherein the refractory metal can assembly includes a refractory metal can assembly that substantially surrounds the substrate and the volume of the carbide powder, and wherein the refractory metal can assembly is fabricated from at least one refractory metal selected from the group consisting of niobium, tantalum, molybdenum, and rhenium.
23. The method of claim 18 wherein the DEC layer has a thickness of about 0.0275 inch to about 0.040 inch.
24. The method of claim 18 wherein removing a portion of the refractory metal can assembly from at least the proximal portion of the substrate such that at least a portion of the refractory metal can assembly remains bonded to at least part of the DEC layer includes removing the portion by grinding, abrasive blasting, machining, or combinations thereof.
25. A method of making a cutting element, comprising:
providing a substrate having a proximal portion and a distal portion, and a volume of a carbide powder adjacent to the distal portion, wherein the carbide powder is intermixed with a plurality of diamond particles;
at least partially surrounding the substrate and the volume of the carbide powder within a refractory metal can assembly;
exposing the refractory metal can assembly containing the substrate and the volume of the carbide powder to a high-pressure, high-temperature process to form a sintered diamond-enhanced carbide (“DEC”) layer that is bonded to at least the distal portion of the substrate; and
blasting the refractory metal can assembly with an abrasive media to remove substantially all of the refractory metal can assembly from the substrate and the DEC layer.