Indirect evaporative coolers with enhanced heat transfer
View Patent ↗A separator plate assembly for use in an indirect evaporative cooler (IEC) with an air-to-air heat exchanger. The assembly includes a separator plate with a first surface defining a dry channel and a second surface defining a wet channel. The assembly includes heat transfer enhancements provided on the first surface for increasing heat transfer rates. The heat transfer enhancements may include slit fins with bodies extending outward from the first surface of separator plate or may take other forms including vortex generators, offset strip fins, and wavy fins. In slit fin implementations, the separator plate has holes proximate to each of the slit fins, and the separator plate assembly may include a sealing layer applied to the second surface of the separator plate to block air flow through the holes. The sealing layer can be a thickness of adhesive, and a layer of wicking material is applied to the adhesive.
1. A separator plate assembly for use in an indirect evaporative cooler (IEC), comprising:
a separator plate with a body having a first surface for use in defining and contacting a dry channel in the IEC and a second surface opposite the first surface for use in defining a wet channel in the IEC; and
heat transfer enhancements provided on the first surface, whereby the heat transfer enhancements comprise a pattern of features structured to at least periodically disrupt airflow traveling across the first surface within the dry channel.
2. The assembly of claim 1 , wherein the heat transfer enhancements include a plurality of slit fins with bodies extending outward from the first surface of separator plate.
3. The assembly of claim 2 , wherein the slit fins are selected from the group of fins consisting of: bridge fins, tabbed fins, asymmetrical conical fins, and vortex-generating fins.
4. The assembly of claim 2 , wherein the separator plate includes a hole extending through the separator plate body proximate to each of the slit fins and the separator plate assembly further includes a sealing layer applied to the second surface of the separator plate to block air flow through the holes.
5. The assembly of claim 4 , wherein the sealing layer comprises a thickness of adhesive adhered to the second surface of the separator plate.
6. The assembly of claim 5 , further comprising a layer of wicking material applied to a surface of the sealing layer opposite the second surface of the separator plate.
7. The assembly of claim 6 , further comprising a support member sandwiched between the layer of wicking material and the sealing layer, the support member comprising at least one of a sheet of plastic, a sheet of metal, and a foil member.
8. The assembly of claim 1 , wherein heat transfer enhancements include shaping the body of the separator plate to have a non-planar cross sectional shape whereby at least one of the first and second surfaces has a wavy or sinusoidal shape.
9. An indirect evaporative cooler for use with a liquid desiccant dehumidifier, comprising:
a first separator plate with first and second surfaces;
a second separator plate with first and second surfaces, wherein the first and second separator plates are arranged with the first surfaces spaced apart and facing each other to define an air flow channel between the first and second separator plates, and wherein the first surfaces contact the air flow channel; and
heat transfer enhancements provided within the air flow channel.
10. The cooler of claim 9 , wherein the heat transfer enhancements comprise slit fins extending outward from the first surfaces into the air flow channel.
11. The cooler of claim 10 , wherein the slit fins are selected from the group of fins consisting of: bridge fins, tabbed fins, asymmetrical conical fins, and vortex-generating fins.
12. The cooler of claim 10 , further comprising a sealing layer covering each of the second surfaces to block air flow from the air flow channel through the first and second separator plates and a wicking layer attached to each of the sealing layers opposite the first and second separator plates.
13. The cooler of claim 12 , wherein the sealing layer comprises a layer of adhesive.
14. The cooler of claim 12 , further including an end cap sealing the air flow channel at one end and extending between the first and second separator plates, whereby liquid coolant directed to flow over the end cap and into the wicking layers is blocked from flowing into the air flow channel.
15. The cooler of claim 14 , wherein the end cap, the first separator plate, and the second separator plate are integrally formed from a metal sheet.
16. The cooler of claim 14 , wherein the end cap comprises a portion of the wicking layer extending between the first and second separator plates.
17. The cooler of claim 9 , wherein the heat transfer enhancements comprise an insert of offset strip fins sandwiched between the first and second separator plates.
18. The cooler of claim 9 , wherein the heat transfer enhancements include wavy or sine fins extending from at least the first surfaces.
19. An indirect evaporative cooler, comprising:
a separator plate with a planar metal body with first and second surfaces;
on the first surface, a plurality of fin bodies extending outward from the planar metal body and a plurality of holes associated with each of the fin bodies extending through the planar metal body;
a sealing layer applied to the second surface of the planar metal body, the sealing layer adapted to block air flow through the holes in the planar metal body; and
a layer of wicking material applied to the sealing layer.
20. The indirect evaporative cooler of claim 19 , wherein the fin bodies comprise bridge shaped members arranged to be parallel to each other, to be in staggered rows on the first surface, and to be orthogonal to a flow direction of air across the first surface in the indirect evaporative cooler.
21. The indirect evaporative cooler of claim 19 , wherein the fin bodies include pairs of turbulators adapted to create opposite direction vortices in air flowing over the first surface.