Intrauterine contraceptive devices
View Patent ↗A contraceptive intrauterine device having a support structure configured for transcervical implantation in a uterus, an active element coupled to the support structure, the active element having a core including copper that is at least partially coated with an outer layer including gold or gold alloy. A contraceptive intrauterine device having a support structure configured for transcervical implantation in a uterus, an active element coupled to the support structure, the active element including a copper core that is at least partially plated or coated with an outer layer including gold or gold alloy, wherein the copper core is configured to release copper ions after the device is implanted in a uterus, and wherein the gold or gold alloy outer layer is configured to control the release rate of copper ions release by the core. Methods for preventing conception by implanting said contraceptive intrauterine devices.
1. A contraceptive intrauterine device, comprising:
a support structure configured for transcervical implantation in a uterus,
an active element coupled to the support structure, the active element comprising a copper core that is at least partially plated or coated with an outer layer comprising gold or gold alloy, wherein the copper core is configured to release copper ions after the device is implanted in a uterus, and wherein the gold or gold alloy outer layer is configured to control the release rate of copper ions release by the core.
2. The contraceptive intrauterine device of claim 1 , wherein the outer layer has a thickness of about 7 to 12 micro centimeters.
3. The contraceptive intrauterine device of claim 1 , wherein the copper core has a surface area of about 200 to 1000 square millimeters.
4. The contraceptive intrauterine device of claim 1 , wherein a thickness of the outer layer is selected so that a release rate of copper ions during an initial period of use in a uterus is substantially less than a release rate that would occur in the absence of the outer layer.
5. A contraceptive intrauterine device, comprising:
a support structure configured for transcervical implantation in a uterus,
an active element coupled to the support structure, the active element including a core comprising copper that is at least partially coated with an outer layer comprising gold or gold alloy, wherein the active element is configured to release copper ions after implantation in a uterus at a release rate dependent on both a surface area of the copper core and a thickness of the outer layer.
6. The contraceptive intrauterine device of claim 5 , wherein the thickness of the outer layer is selected so that a release rate of copper ions during an initial period of use in a uterus is substantially less than a release rate that would occur in the absence of the outer layer.
7. The contraceptive intrauterine device of claim 5 , wherein the thickness of the outer layer is selected to decrease by at least about 50% a release rate of copper ions during an initial period of use in a uterus over a release rate that would occur in the absence of the outer layer.