Module package and production method
The invention relates to a module package which comprises a module substrate 1 , a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8 , and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1 , wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1 . A filler is added to the encapsulation layer 8 . The encapsulation layer 8 partly fills underneath the chip 2, 3 , wherein at most the part of the chip 2, 3 , on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3.
1. A module package comprising:
a module substrate;
at least one chip which has component structures on its top side and the top side of which faces the module substrate, wherein a gap is formed between the chip top side and the module substrate; and
an encapsulation layer comprising a molding material with which a filler is admixed,
wherein the encapsulation layer only partly underfills the chip,
wherein as a maximum the part of the chip on which no component structures are situated is underfilled, and as a minimum the encapsulation layer terminates virtually flush with the side areas of the chip, and
wherein the filler has a particle size distribution in which at least one third of the filler particles have a diameter greater than the height of the gap between the chip top side and the module substrate.
2. The module package according to claim 1 , wherein the filler forms at least 75 percent by mass of the encapsulation layer.
3. The module package according to claim 1 , wherein the filler comprises silicon oxide.
4. The module package according to claim 1 , wherein the module substrate or chip has a supporting structure that narrows the gap between the chip and the module substrate.
5. The module package according to claim 1 , wherein at least one further component is applied on the module substrate, wherein a gap between the component and the module substrate is completely sealed with a filling compound.
6. The module package according to claim 1 , wherein the at least one chip comprises a SAW filter mounted using the flip-chip method.
7. A module package comprising:
a module substrate;
at least one chip which has component structures on its top side and the top side of which faces the module substrate, wherein a gap is formed between the chip top side and the module substrate; and
an encapsulation layer comprising a molding material with which a filler is admixed,
wherein the encapsulation layer only partly underfills the chip, wherein as a maximum the part of the chip on which no component structures are situated is underfilled, and as a minimum the encapsulation layer terminates virtually flush with the side areas of the chip,
wherein the filler has a particle size distribution in which at least one third of the filler particles have a diameter greater than the height of the gap between the chip top side and the module substrate, and
wherein the filler particles have angular outer surfaces.
8. A method for producing a module,
wherein a module carrier with at least one chip having component structures on its top side is populated in such a way that the top side of the chip faces the module carrier and a gap is formed between the chip top side and the module carrier,
wherein a molding compound, comprising a molding material with which a filler is admixed, is applied to at least one part of the module over a large area,
wherein the molding compound is cured to form an encapsulation layer,
wherein the material of the molding compound is selected in such a way that it has a gap penetration that leads to only partly underfilling of the at least one chip in such a way that as a maximum the part of the chip on which no component structures are situated is underfilled, and as a minimum the encapsulation layer terminates virtually flush with the side areas of the chip, and
wherein the filler has a particle size distribution in which at least one third of the filler particles have a diameter greater than the height of the gap between the chip top side and the module carrier.
9. The method according to claim 8 , wherein further components are applied on the module carrier, wherein a gap between the component and the module carrier is sealed with a filling compound.
10. The method according to claim 8 , wherein the molding compound is solidified thermally or by irradiation.
11. A method for producing a module,
wherein a module carrier with at least one chip having component structures on its top side is populated in such a way that the top side of the chip faces the module carrier and a gap is formed between the chip top side and the module carrier,
wherein a molding compound, comprising a molding material with which a filler is admixed, is applied to at least one part of the module over a large area,
wherein the molding compound is cured to form an encapsulation layer,
wherein the material of the molding compound is selected in such a way that it has a gap penetration that leads to only partly underfilling of the at least one chip in such a way that as a maximum the part of the chip on which no component structures are situated is underfilled, and as a minimum the encapsulation layer terminates virtually flush with the side areas of the chip,
wherein the filler has a particle size distribution in which at least one third of the filler particles have a diameter greater than the height of the gap between the chip top side and the module carrier, and
wherein temperature and pressure are chosen during method in such a way that a minimum viscosity of the molding compound is not undershot.