SEMIFINISHED PRODUCT AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE

1 . A semifinished product for producing a light-emitting diode comprising:

a flexible supporting material;

a first and a second contact area, arranged on the supporting material, configured to produce electrical connections;

a light-emitting diode chip or a holder for a light-emitting diode chip, arranged on the supporting material;

a foldable flap, formed into the supporting material, the flap being arranged in such a way that it is foldable towards and/or onto the light-emitting diode chip; and

at least a first electrical connecting web, arranged on the foldable flap, which is connected to the first contact area and is configured to be connected to a first terminal of the light-emitting diode chip by folding of the flap.

2 . The semifinished product according to claim 1 ,

wherein the second contact area is connected to a second terminal of the light-emitting diode chip by way of a second electrical connecting web.

3 . The semifinished product according to claim 1 , further comprising:

a second electrical connecting web, arranged on the foldable flap, which is connected to the second contact area and is configured to be connected to a second terminal of the light-emitting diode chip by folding of the flap.

4 . A semifinished product for producing a light-emitting diode comprising:

a flexible supporting material;

a first and a second contact area, arranged on the supporting material, configured to produce electrical connections;

a first and a second electrical connecting web arranged on the supporting material, the electrical connecting webs being respectively connected to the first and second contact areas;

a foldable flap, formed into the supporting material; and

a light-emitting diode chip, arranged on the flap, or a holder for a light-emitting diode chip, arranged on the flap;

wherein the flap and the first and second connecting webs are arranged in such a way that a first and a second terminal of the light-emitting diode chip are respectively connected to the first and second connecting webs by folding of the flap.

5 . The semifinished product according to one of claims 1 and 4 ;

wherein the flap is fixed on the light-emitting diode chip by an adhesive after the folding.

6 . The semifinished product according to claim 5 ;

wherein the adhesive contains phosphorus compounds, in order to convert the frequency of the radiation radiated by the light-emitting diode chip.

7 . The semifinished product according to one of claims 1 and 4 ;

wherein the flap is at least partially transparent with respect to the radiation emitted by the light-emitting diode chip.

8 . The semifinished product according to one of claims 1 and 4 ;

wherein the flap contains phosphorus compounds, in order to convert the frequency of the radiation radiated by the light-emitting diode chip.

9 . The semifinished product according to one of claims 1 and 4 , further comprising:

a reflector, configured to reflect the radiation radiated by the light-emitting diode chip, which is arranged on the flap.

10 . The semifinished product according to one of claims 1 and 4 ;

wherein the first and second contact areas are respectively connected to a contact pin.

11 . The semifinished product according to one of claims 1 and 4 ;

wherein the first and/or second contact area, arranged on the supporting material are configured to be deformed into a contact pin.

12 . The semifinished product according to one of claims 1 and 4 , further comprising:

multiple light-emitting diode chips and/or holders for light-emitting diode chips.

13 . The semifinished product according to claim 12 , further comprising;

multiple foldable flaps, formed into the supporting material, the flaps being arranged in such a way that they can be respectively folded towards and/or onto one of the light-emitting diode chips.

14 . A method for producing a light-emitting diode, comprising the steps of:

providing a semifinished product according to one of claims 1 and 4 ;

folding the flap;

optionally applying the contact pins to the contact areas arranging the semifinished product in a lens casting body; and

filling the lens casting body with a casting compound for producing a lens body.

15 . The method according to claim 14 ;

wherein an adhesive is applied to the flap or the light-emitting diode chip.

16 . The method according to claim 14 ;

wherein the semifinished product being is deformed in such a way that the contact pins connected to the contact areas are arranged approximately parallel to one another at a specific distance from one another, preferably 3 mm or 5 mm.

17 . The method according to claim 14 ;

wherein the contact pins are soldered to the contact areas.

18 . The method according to claim 14 ;

wherein the contact pins are connected to the contact areas electrically and mechanically.

19 . The method according t 0 claim 14 , further comprising:

providing a sheet having multiple semifinished products according to one of claims 1 and 4 , by punching out the multiple semifinished products.

20 . The method according to claim 14 , further comprising:

arranging the light-emitting diode chip in the holder for the light-emitting diode chip by means of the following method:

applying an adhesive-repellent composition to at least a sub-surface of the semifinished product, which surrounds the holder for the light-emitting diode chip;

curing the adhesive-repellent composition;

applying an adhesive composition to the holder for the light-emitting diode chip; and

applying the light-emitting diode chip the adhesive composition located in the holder for the light-emitting diode chip, the adhesive-repellent composition being a radiation-curing nonstick coating compound;

wherein the sub-surface of the semifinished product that is provided with the adhesive-repellent composition encloses and boarders the holder for the light-emitting diode chip that is provided with the adhesive composition.

21 . Light-emitting diode comprising:

at least one light-emitting diode chip, that is produced by the method according to claim 14 .