IP Library Granted Patent US 9,160,069
Granted Patent B2
US 9,160,069 · App. 13/810,786 · Granted Oct 13, 2015

Grounded antenna with cross-shaped high-impedance surface metal strips and wireless communication device having said antenna

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Quick Facts
Patent No.
US 9,160,069
App. No.
13/810,786
Granted
Oct 13, 2015
Kind
B2
Abstract

A grounded antenna may include cross-shaped high-impedance surface metal strips and a wireless communication device having said antenna. The antenna may include an antenna radiation unit and a ground plate and may be set inside of a housing. Multiple high-impedance surface units may be arranged on the ground plate in intervals.

Claims (31)

1. A grounded antenna with cross-shaped high-impedance surface metal strips, comprising:

an antenna radiating element and a ground plate thereof,

wherein multiple high-impedance surface units are arranged on the ground plate in intervals, wherein the high-impedance surface units are electrically isolated from the ground plate, and

wherein at least one high-impedance surface unit is composed of two high-impedance surface metal strips to form a cross;

a high-impedance surface through hole is made at the intersection of the cross,

wherein the high-impedance surface units are connected with each other via a metal layer that is electrically isolated from the ground plate through use of the high impedance surface through holes to define a two-dimensional electric filter used to prevent current flow along the ground plate.

2. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein the ground plate is a printed circuit board, the high-impedance surface units are arranged on a surface of the printed circuit board, and the high-impedance surface through holes are set to pass through the printed circuit board.

3. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein a length of the metal strips composing the cross-shaped high-impedance surface is about 10 mm, a distance range between two adjacent high-impedance surface metal strips is about 0.5 mm to 1.5 mm, and a length range of an overlapping section is about 2.5 mm to 3.5 mm.

4. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein the cross-shaped high-impedance surface units are arranged on the ground plate in lines.

5. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 4 , wherein at least one high-impedance surface metal strip is inclined relative to the lines formed by the high-impedance surface units.

6. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein: the cross-shaped high-impedance surface units are arranged on the ground plate in rows.

7. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 6 , wherein at least one of the high-impedance surface metal strips is inclined relative to the rows formed by the high-impedance surface units.

8. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein among the high-impedance surface units, the high-impedance surface metal strips are set in substantially parallel.

9. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein the antenna radiating element is a planar inverted-F antenna.

10. A wireless communication device, comprising:

a housing and an antenna used for communicating;

wherein the antenna is arranged in the housing comprising an antenna radiating element and a ground plate thereof;

multiple high-impedance surface units arranged on the ground plate in intervals, wherein the high-impedance surface units are electrically isolated from the ground plate, and,

wherein at least one high-impedance surface unit is composed of two high-impedance surface metal strips to form a cross;

a high-impedance surface through hole made at the intersection of the cross,

wherein the high-impedance surface units are connected with each other via a metal layer that is electrically isolated from the ground plate through use of the high-impedance surface through holes such that a radiation capability of the antenna, associated with a return loss of the ground plate, is unaffected by the high-impedance surface units.

11. The wireless communication device of claim 10 , wherein the high-impedance surface metal strips are substantially perpendicular or substantially parallel to the high-impedance surface units.

12. The wireless communication device of claim 10 , wherein a surface impedance is inductive in response to the surface impedance being lower than a resonance frequency.

13. The wireless communication device of claim 10 , wherein a surface impedance is capacitive in response to the surface impedance being higher than a resonance frequency.

14. The wireless communication device of claim 10 , wherein the cross-shaped high-impedance surface units are arranged on the ground plate in lines.

15. The wireless communication device of claim 14 , wherein at least one of the high-impedance surface metal strips is inclined relative to the lines formed by the high-impedance surface units.

16. The wireless communication device of claim 10 , wherein the cross-shaped high impedance surface units are arranged on the ground plate in rows.

17. The wireless communication device of claim 16 , wherein at least one of the high-impedance surface metal strips is inclined relative to the rows formed by the high-impedance surface units.

18. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein the high-impedance surface metal strips are substantially perpendicular to the high-impedance surface units.

19. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein a surface impedance is inductive in response to the surface impedance being lower than a resonance frequency.

20. The grounded antenna with cross-shaped high-impedance surface metal strips of claim 1 , wherein a surface impedance is capacitive in response to the surface impedance being higher than a resonance frequency.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2021
From: HUIZHOU TCL MOBILE COMMUNICATION CO LTD
To: COLUMBIA PEAK VENTURES, LLC
Reel/Frame 056846/0912 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2013
From: ZHANG, LIAN
To: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD
Reel/Frame 029650/0218 →