Method for producing laminated electronic component, and laminated electronic component
View Patent ↗A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
1. A method of manufacturing a laminated electronic part, comprising:
fabricating a first laminated sheet by laminating one or more insulating function layers mainly made of an unsintered ceramic material and one or more conductor layers, each having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction, said conductors making up at least part of circuit components;
fabricating a second laminated sheet by laminating one or more insulating function layers mainly made of an unsintered ceramic material and one or more conductor layers, each having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction, said conductors making up at least part of circuit components;
cutting said first laminated sheet into sticks such that said sticks include a plurality of conductors arranged either in the vertical direction or in the horizontal direction, thereby creating a plurality of first laminate sticks;
cutting said second laminated sheet into sticks such that said sticks include a plurality of conductors arranged either in the vertical direction or in the horizontal direction, thereby creating a plurality of second laminate sticks;
fabricating a third laminated sheet by rotating said second laminate sticks by 90° about a longitudinal axis of said second laminate stick, arranging said rotated second laminate sticks to be each sandwiched between said first laminate sticks, and thermocompression bonding said first laminate sticks and second laminate sticks for integration;
singulating said third laminated sheet into chips by cutting said third laminated sheet in the vertical direction and in the horizontal direction such that each chip includes a first laminate which is part of said first laminate stick and a second laminate which is part of said second laminate stick; and
creating sintered bodies by sintering said unsintered chips to integrate said first laminate with said second laminate.
2. A method of manufacturing a laminated electronic part according to claim 1 , wherein said step of fabricating a first laminated sheet includes:
fabricating a plurality of first ceramic sheets by printing conductors which form at least part of circuit components on a surface of a ceramic green sheet mainly made of an unsintered ceramic material such that the conductors are two-dimensionally arranged in the vertical direction and in the horizontal direction; and
creating said first laminated sheet by putting said plurality of first ceramic sheets one on another, and thermocompression bonding said plurality of first ceramic sheets into integration, and
said step of fabricating a second laminated sheet includes the steps of:
fabricating a plurality of second ceramic sheets by printing conductors which form at least part of circuit components on a surface of a ceramic green sheet mainly made of an unsintered ceramic material such that the conductors are two-dimensionally arranged in the vertical direction and in the horizontal direction; and
creating said second laminated sheet by putting said plurality of second ceramic sheets one on another, and thermocompression bonding said plurality of second ceramic sheets into integration.