Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment
The invention relates to a device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment. The device comprises a flow distributor body which is disposed, with the front face thereof, plane-parallel to a substrate to be processed, and which has outlet openings on the front face, through which process solution flows onto the substrate surface. The process solution flowing back from the substrate is led off through connecting passages onto the rear face of the flow distributor body. At the same time a targeted distribution of an electrical field on a conductive substrate surface is effected by a specific arrangement of said connecting passages.
1. A device for creating targeted flow and current density patterns in a chemical and/or electrolytic surface treatment of a substrate in a fluidic process solution, the device comprising:
a flow distributor body having a front face facing the substrate during the surface treatment, wherein the front face has dimensions at least as big as dimensions of the surface of the substrate to be treated, and
a rear face opposite of the front face,
wherein the flow distributor body comprises at least one inlet opening for the process solution, and at least one liquid passage,
wherein the at least one liquid passage has at least one outlet opening at the front face for creating an incoming flow on the substrate,
and wherein the flow distributor body has at least one connecting passage for receiving a backflow from the substrate, wherein the at least one connecting passage extends from the front face to the rear face, wherein the at least one connecting passage has a larger diameter, or a larger width, respectively, than the at least one outlet opening.
2. The device according to claim 1 , wherein the arrangement of the at least one outlet opening on the front face corresponds approximately to a structure to be located on the substrate.
3. The device according to claim 1 , wherein the arrangement of the at least one connecting passage on the front face corresponds approximately to the structure to be located on the substrate.
4. The device according to claim 1 , wherein the at least one outlet opening has a diameter, or a width, respectively, of between 0.05 mm and 10 mm.
5. The device according to claim 1 , wherein the diameter, or the width, respectively, of the connecting passage provides a dimension up to the substrate size.
6. The device according to claim 1 , wherein the inlet opening is located outside of an incoming flow zone and/or backflow zone.
7. A method for creating targeted flow and current density patterns in a chemical and/or electrolytic surface treatment of a substrate in a fluidic process solution, the method comprising:
inserting a flow distributor body with at least one liquid passage into the fluidic process solution, wherein the front face has dimensions at least as big as dimensions of the surface of the substrate to be treated;
aligning the flow distributor body such that its front face is positioned plane-parallel to the substrate to be treated; and
pumping the process solution through at least one inlet opening such that the process solution impinges upon the substrate as an incoming flow through the at least one outlet opening, and flows off as a backflow through at least one connecting passage, the at least one connecting passage has a larger diameter, or a larger width, respectively, than the at least one outlet opening.
8. The method according to claim 7 wherein the substrate is connected to a first electrode, wherein a counter electrode body is in the process solution, wherein the counter electrode body is connected to a second electrode having a polarity that is reverse to that of the first electrode.
9. The method according to claim 7 , wherein the flow distributor body, and/or the substrate perform a relative movement directed parallel to each other during the pumping of the process solution.
10. The method according to claim 7 , wherein the substrate comprises a conductor plate, a semi-conductor substrate, a film substrate, or an essentially plate-shaped, metal or metallized workpiece, and that the surface to be treated is masked or unmasked.
11. The method according to claim 7 , wherein a galvanized coating, chemical or electrochemical etching, anodal oxidation, or another method of the external currentless metal separation is performed.