Optoelectronic device and method for the production thereof

1. An optoelectronic device comprising:

an optoelectronic component with a first substrate on which are arranged an active region and a first contact region;

at least one first contact layer arranged in the first contact region; and

a second component with a second substrate on which is arranged at least one second contact layer arranged in a second contact region,

wherein

the first contact layer connects electrically conductively with the active region,

the first contact layer and the second contact layer are bonded together electrically conductively via an adhesive layer comprising an electrically conductive adhesive, and

the first contact layer and/or the second contact layer are at least partly patterned, and

the first contact layer and/or the second contact layer comprises sub-regions, separated from one another at least in part by separating regions filled with the electrically conductive adhesive.

2. The optoelectronic device according to claim 1 , further comprising a bonding layer between the first contact layer and the first substrate and/or the second contact layer and the second substrate.

3. The optoelectronic device according to claim 2 , wherein the electrically conductive adhesive and the material of the bonding layer or of the substrate is selected such that the electrically conductive adhesive adheres better to the bonding layer or the substrate than to the first contact layer.

4. The optoelectronic device according to claim 1 , wherein the first contact layer and/or the second contact layer comprises a metal.

5. The optoelectronic device according to claim 1 , wherein the electrically conductive adhesive is an anisotropically conductive adhesive.

6. The optoelectronic device according to claim 5 , wherein the device is configured such that the anisotropically conductive adhesive provides substantially only an electrical conductivity which extends substantially vertically relative to the mutually facing surfaces of the first contact layer and the second contact layer.

7. The optoelectronic device according to claim 1 , wherein at least one of the sub-regions of the first contact layer and/or the second contact layer is covered with the adhesive layer over at least part of the lateral faces.

8. The optoelectronic device according to claim 1 , further comprising a first electrode.

9. The optoelectronic device according to claim 1 , wherein width of the separating regions is 0.1 to 0.5 mm.

10. The optoelectronic device according to claim 1 , wherein the sub-regions comprise at least one central region and at least one peripheral region, and a longitudinal extent of the peripheral region is smaller than that of the central region.

11. The optoelectronic device according to claim 1 , wherein at least two separating regions are present.

12. The optoelectronic device according claim 1 , wherein the optoelectronic component is an organic optoelectronic component.

13. A method of producing an optoelectronic device comprising:

A) providing an optoelectronic component with an active region and at least one first contact layer arranged on a first substrate in a first contact region, the first contact layer being connected electrically conductively with the active region;

B) providing a second component with a second substrate with at least one second contact layer arranged in a second contact region;

D) applying an electrically conductive adhesive in the first contact region and/or in the second contact region; and

E) arranging the second substrate over the first substrate such that the first contact layer connects electrically conductively with the second contact layer via the electrically conductive adhesive;

wherein the first contact layer and/or the second contact layer are here applied in a step C1) in patterned manner before being provided or are patterned in a step C2) subsequent to step A) and/or step B) and wherein the first contact layer and/or the second contact layer comprises sub-regions, separated from one another at least in part by separating regions filled with the electrically conductive e adhesive.

14. The method according to claim 13 , wherein the first contact layer and/or the second contact layer are patterned in step C2) by etching.

15. An optoelectronic device comprising:

an optoelectronic component with a first substrate on which are arranged an active region and a first contact region,

at least one first contact layer arranged in the first contact region,

a second component with a second substrate on which is arranged at least one second contact layer arranged in a second contact region,

wherein

1) the first contact layer connects electrically conductively with the active region,

2) the first contact layer and the second contact layer are bonded together electrically conductively via an adhesive layer comprising an electrically conductive adhesive,

3) the first contact layer and/or the second contact layer are patterned at least in part, and

4) the first contact layer and/or the second contact layer comprises sub-regions separated from one another at least in part by separating regions filled with the electrically conductive adhesive, the sub-regions being connected together electrically conductively.