Method for producing a plurality of electronic devices
An electronic device comprises a substrate ( 120 ), at least one electronic component ( 171, 172, 173 ) arranged on the substrate, and an encapsulation ( 140 ) covering the at least one electronic component ( 171, 172, 173 ). An electromagnetic protective layer ( 130 ) covers a surface ( 143 ) of the encapsulation ( 140 ) that faces away from the substrate ( 120 ), and the side faces ( 121, 141; 122, 142 ) directed transversely with respect to the surface ( 143 ). In particular, a thermal and/or electrical coupling ( 134, 162, 163, 164, 165, 166 ) couples the electromagnetic protective layer ( 130 ) thermally and/or electrically to a region ( 168 ) of the electronic device ( 111, 112 ) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer ( 130 ) is subsequently applied.
1. A method for producing a plurality of electronic devices, comprising:
providing an areally extended panel comprising a substrate;
singulating the panel to form the plurality of electronic devices;
applying a respective electromagnetic protective layer to the devices of the plurality of electronic devices after singulation, such that the electromagnetic protective layer covers the side faces of the substrate that are exposed by the singulation,
wherein the electromagnetic protective layer is in each case applied to the devices such that the electromagnetic protective layer in each case completely covers at least one surface of the electronic devices that faces away from the substrate, and
wherein the electromagnetic protective layer is in each case applied to the devices such that the electromagnetic protective layer in each case covers at least the side faces of the electronic devices that are directed transversely with respect to the at least one surface of the electronic devices, such that a respective region of the side faces of the of the at least one surface of the electronic devices which adjoins an underside situated opposite the at least one surface of the electronic devices is free of the electromagnetic protective layer; and
forming at least one notch into the substrate in the region prior to applying the electromagnetic protective layer.
2. The method according to claim 1 , wherein applying the electromagnetic protective layer comprises:
sputtering deposition of a partial layer comprising titanium or of a partial layer comprising copper.
3. The method according to claim 1 or 2 , wherein applying the electromagnetic protective layer comprises:
applying a partial layer comprising nickel in an electroless fashion.
4. The method according to claim 1 comprising:
laser inscription of the panel prior to singulation.
5. The method according to claim 1 , comprising:
plasma cleaning of the plurality of electronic devices prior to applying the protective layer.
6. The method according to claim 1 , wherein the electromagnetic protective layer is in each case applied to the devices such that the electromagnetic protective layer in each case completely covers at least the side faces of the electronic devices that are directed transversely with respect to the at least one surface of the electronic devices.