Assembly having a semiconductor light source and support for a printed circuit board, and method for mounting the assembly

1. An assembly comprising a printed circuit board, a support, at least one first securing element on the printed circuit board, and at least one second securing element on the support, wherein the at least one first securing element is configured to mate with the at least one second securing element for securing the printed circuit board to the support,

wherein the printed circuit board comprises a front side, for population with at least one semiconductor light source, and a rear side, wherein the at least one first securing element is accessible via the rear side, and wherein the at least one first securing element is formed as an electrical through-conduction element for the at least one semiconductor light source,

wherein the support includes a support area for emplacing the printed circuit board, wherein the at least one second securing element is arranged on the support area, and wherein the at least one second securing element is formed as an electrical through-conduction element, and

wherein one of (i) the at least one first securing element and (ii) the at least one first securing element is a cutout in the shape of a keyhole, and a soldering region is at the end of the narrow portion of the keyhole and positioned to be engageable by the other of the first and second securing elements.

2. The assembly as claimed in claim 1 ,

wherein the at least one first securing element is formed as an electrically conductive securing element and led through the printed circuit board.

3. The assembly as claimed in claim 1 ,

wherein the printed circuit board includes a plurality of first securing elements arranged symmetrically with respect to an axis of symmetry of the printed circuit board.

4. The assembly as claimed in claim 1 ,

wherein the printed circuit board includes a plurality of first securing elements configured in a coded manner and arranged in the coded manner.

5. The assembly as claimed in claim 1 , wherein the at least one first securing element comprises at least one electrically conductive securing pin projecting from the rear side.

6. The assembly as claimed in claim 1 , wherein the at least one first securing element is formed as a keyhole.

7. The assembly as claimed in claim 1 , wherein the at least one second securing element is electrically conductive and is connected to at least one electrical supply.

8. The assembly as claimed in claim 1 , wherein the at least one second securing element is formed as the keyhole for receiving the first securing element of the printed circuit board, wherein the first securing element is electrically conductive and projects from the rear side of the printed circuit board.

9. The assembly as claimed in claim 8 , wherein the at least one second securing element is formed as a keyhole.

10. The assembly as claimed in claim 1 , wherein the at least one second securing element includes a latching means for releasably latching an inserted first securing element.

11. The assembly as claimed in claim 1 , wherein the support forms part of a heat sink.

12. The assembly for a printed circuit board as claimed in claim 1 , wherein the support includes at least one support area for at least indirectly emplacing the printed circuit board, wherein at least one second securing element for respectively securing a first securing element of the printed circuit board is arranged on the at least one support area, and wherein the at least one second securing element is electrically conductive and functionally connected to at least one electrical supply.

13. The assembly as claimed in claim 12 , wherein the at least one second securing element comprises at least one electrically conductive securing pin projecting from the support area.

14. The assembly as claimed in claim 12 , wherein the support is a driver housing.

15. The assembly as claimed in claim 1 , wherein a thermally conductive layer is introduced between the printed circuit board and the support, and wherein the thermally conductive layer includes at least one cutout for at least one of leading through the first securing element and leading through the second securing element.

16. The assembly as claimed in claim 1 , wherein a heat sink is introduced between the printed circuit board and the support, and wherein the heat sink includes at least one cutout for at least one of leading through the first securing element and leading through the second securing element.

17. The assembly as claimed in claim 16 , wherein the heat sink is at least partly plugged over the support.

18. The assembly as claimed in claim 1 , wherein the printed circuit board is arranged on a receptacle of the heat sink.

19. The assembly as claimed in claim 1 , comprising at least one fixing element for fixing a position of the printed circuit board.

20. A method for securing the printed circuit board to the support in the assembly as claimed in claim 1 , wherein the at least one second securing element is arranged on the support area, and wherein the at least one first securing element of the printed circuit board is inserted by a plugging movement or a plugging/rotating movement into a matching second securing element of the support in at least one of a force-locking manner and a positively locking manner.

21. A method for securing the printed circuit board populated with at least one semiconductor light source to the support in the assembly as claimed in claim 1 , the method comprising the steps of:

plugging a heat sink onto the support such that the at least one electrically conductive securing pin which projects from the support and which is connected to an electrical supply projects through the heat sink;

placing the printed circuit board onto the heat sink such that the at least one securing pin projecting through the heat sink projects at least partly into an associated keyhole of the printed circuit board;

securing the at least one securing pin in the associated keyhole, such that at least one securing pin is electrically connected to at least one semiconductor light source; and

fixing a relative rotational position between the support and the printed circuit board via a fixing element comprising a plurality of widening regions arranged angularly on the fixing element and which engage into lateral recesses of the printed circuit board.

22. The method as claimed in claim 21 , wherein securing the at least one securing pin in the associated keyhole is performed via a rotating movement between the support and the printed circuit board.

23. The assembly as claimed in claim 1 , wherein the system comprises a-lamp.

24. The assembly as claimed in claim 1 , further comprising a lamp.