Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

1. An optoelectronic semiconductor chip comprising a carrier and a semiconductor body having a semiconductor layer sequence, said semiconductor body being arranged on the carrier wherein:

an emission region and a detection region are formed in the semiconductor body having the semiconductor layer sequence;

the semiconductor layer sequence comprises an active region arranged between a first semiconductor layer and a second semiconductor layer and provided in the emission region to generate radiation;

the first semiconductor layer is arranged on the side of the active region facing away from the carrier;

the emission region has a recess extending through the active region;

the first semiconductor layer electrically conductively connects to a first contact in the emission region via a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer in the direction of the carrier, and

the first connection layer extends through the recess towards the carrier and the first connection layer extends between the second semiconductor layer and the carrier when seen in a vertical direction which runs perpendicular to a main extension plane of the semiconductor layers of the semiconductor body;

the second semiconductor layer electrically conductively connects to a second contact via a second connection layer; and

the detection region electrically conductively connects to an additional contact.

2. The semiconductor chip according to claim 1 , wherein the semiconductor body cohesively connects to the carrier.

3. The semiconductor chip according to claim 1 , wherein the first connection layer runs regionally between the semiconductor body and the carrier.

4. The semiconductor chip according to claim 1 , wherein the second connection layer runs regionally between the emission region and the first connection layer.

5. The semiconductor chip according to claim 1 , wherein the second contact forms a common contact for the emission and detection regions.

6. The semiconductor chip according to claim 1 , wherein the first contact forms a common contact for the emission and detection regions.

7. The semiconductor chip according to claim 6 , wherein a connection window is formed in the second connection layer, and the first connection layer connects to the second semiconductor layer through the connection window in the detection region.

8. The semiconductor chip according to claim 1 , wherein the additional contact is arranged in the detection region on the first semiconductor layer.

9. The semiconductor chip according to claim 6 , wherein the detection region has an additional recess, and the first connection layer extends in the additional recess from the first semiconductor layer in the further recess in a direction of the carrier.

10. The semiconductor chip according to claim 9 , wherein the second connection layer is subdivided by a cutout into at least two partial regions electrically insulated from one another.

11. The semiconductor chip according to claim 10 , wherein the additional contact and the detection region are arranged alongside one another in a plan view of the semiconductor chip.

12. The semiconductor chip according to claim 1 , wherein the active region of the emission region and the active region of the detection region have the same composition.

13. A method of producing a plurality of optoelectric semiconductor chips comprising:

a) providing a semiconductor layer sequence comprising an active region arranged between a first semiconductor layer and a second semiconductor layer;

b) forming a plurality of recesses extending through the second semiconductor layer and through the active region;

c) forming a first connection layer on the semiconductor layer sequence, wherein the first connection layer electrically conductively connects to the first semiconductor layer in the recesses, and the first connection layer covers the second semiconductor layer at least in regions;

d) forming a composite assembly comprising the semiconductor layer sequence and a carrier;

e) forming a plurality of emission regions and a plurality of detection regions from the semiconductor layer sequence, wherein the emission regions each have at least one recess and the detection regions are each provided with an additional contact electrically insulated from the emission regions; and

f) singulating the composite assembly into a plurality of semiconductor chips, wherein each semiconductor chip comprises at least one emission region and at least one detection region.

14. The method according to claim 13 , wherein, before step e), a growth substrate for the semiconductor layer sequence is removed at least regionally.

15. The method according to claim 13 , wherein a plurality of semiconductor chips comprising a carrier and a semiconductor body having a semiconductor layer sequence, said semiconductor body being arranged on the carrier wherein:

an emission region and a detection region are formed in the semiconductor body having the semiconductor layer sequence;

the semiconductor layer sequence comprises an active region arranged between a first semiconductor layer and a second semiconductor layer and provided in the emission region to generate radiation;

the first semiconductor layer is arranged on the side of the active region facing away from the carrier;

the emission region has a recess extending through the active region;

the first semiconductor layer electrically conductively connects to a first contact in the emission region via a first connection layer wherein the first connection layer extends in the recess from the first semiconductor layer in the direction of the carrier;

the second semiconductor layer electrically conductively connects to a second contact via a second connection layer; and

the detection region electrically conductively connects to an additional contact, are produced.

16. The semiconductor chip according to claim 1 , wherein the semiconductor body has a plurality of recesses extending through the second semiconductor layer and through the active region into the first semiconductor layer, and the first connection layer runs through the recesses and produces an electrical connection to the first semiconductor layer.

17. The semiconductor chip according to claim 1 , wherein an area of the detection region in plan view of the semiconductor chip is smaller than an area of the emission region.

18. The semiconductor chip according to claim 1 , wherein the first connection layer completely or at least substantially completely covers the carrier.

19. The method according to claim 13 , wherein step e) is performed after step d).