Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer
View Patent ↗A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.
1. A process of producing a layer composite comprising a luminescence conversion layer and a scattering layer, in which a molding press having a first pressing tool with a cavity and a second pressing tool is used, comprising:
introducing a first polymer comprising a luminescence conversion substance into the cavity,
inserting a support film between the first and the second pressing tool,
closing the molding press and carrying out a first pressing procedure,
hardening the first polymer to form a luminescence conversion layer in the molding press,
opening the molding press, wherein the luminescence conversion layer adhering to the support film remains in the molding press,
introducing a second polymer comprising scattering particles into the cavity,
closing the molding press and carrying out a second pressing procedure,
hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer in the molding press,
opening the molding press, and
removing the support film with the layer composite comprising the luminescence conversion layer and the scattering layer.
2. The process according to claim 1 , wherein the first polymer and the second polymer have the same base material.
3. The process according to claim 2 , wherein the base material is a silicone.
4. The process according to claim 1 , wherein the support film is fixed onto a support frame.
5. The process according to claim 1 , wherein, prior to introduction of the first polymer and/or introduction of the second polymer, a film is inserted into the cavity of the first pressing tool.
6. The process according to claim 5 , wherein the film is fixed in the cavity by a negative pressure.
7. The process according to claim 1 , wherein the cavity is evacuated after closure of the molding press and prior to carrying out the pressing procedure.
8. The process according to claim 1 , wherein the luminescence conversion layer has a thickness of 10 μm to 200 μm.
9. The process according to claim 1 , wherein the scattering layer has a thickness of 10 μm to 200 μm.
10. The process according to claim 1 , further comprising cutting the layer composite by sawing, punching, cutting, water jet cutting or laser beam cutting.
11. The process according to claim 1 , further comprising applying the layer composite comprising the luminescence conversion layer and the scattering layer to a radiation-emitting, optoelectronic semiconductor chip.