Radiation-emitting component and method for producing a radiation-emitting component
View Patent ↗A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer.
1. A radiation-emitting component comprising a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and comprising a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer, a radiation conversion substance is formed in the connecting layer, a window is formed in the conversion element, through which window electrical contact can be made or electrical contact is made with the semiconductor chip, and the connecting layer overlaps the window at least in regions in a plan view of the semiconductor chip.
2. The radiation-emitting component according to claim 1 , wherein the connecting layer projects beyond the conversion element in a lateral direction at least in regions.
3. The radiation-emitting component according to claim 1 , wherein the window is formed laterally with respect to the semiconductor body in a plan view of the semiconductor chip.
4. The radiation-emitting component according to claim 1 , wherein the connecting layer covers at least in regions a side area delimiting the semiconductor body in a lateral direction.
5. The radiation-emitting component according to claim 1 , wherein the connecting layer contains a polymer material.
6. The radiation-emitting component according to claim 1 , wherein the connecting layer is adapted to the conversion element with regard to conversion of the primary radiation.
7. The radiation-emitting component according to claim 1 , wherein the semiconductor body is free of an electrical contact on a side facing the conversion element.
8. The radiation-emitting component according to claim 1 , wherein the semiconductor chip comprises a contact to externally electrically contact the semiconductor chip and the contact overlaps the window in a plan view of the semiconductor chip.
9. The radiation-emitting component according to claim 8 , wherein the connecting layer adjoins the contact at least in regions.
10. The radiation-emitting component according to claim 8 , wherein the connecting layer adjoins the contact along the entire periphery of the contact.
11. The radiation-emitting component according to claim 8 , wherein the connecting layer covers the contact in regions.