IP Library Granted Patent US 9,012,777
Granted Patent B2
US 9,012,777 · App. 13/819,118 · Granted Apr 21, 2015

Conductive path structure and wire harness

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Quick Facts
Patent No.
US 9,012,777
App. No.
13/819,118
Granted
Apr 21, 2015
Kind
B2
Abstract

A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

Claims (9)

1. A conductive path structure comprising:

a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion; and

a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion,

wherein when the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.

2. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a groove is formed.

3. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor on which a notch is formed.

4. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor in which a through hole is formed.

5. The conductive path structure according to claim 1 , wherein the cut-off facilitating portion is a conductive portion of the conductor having a thin portion thinner than the first and second conductive portions.

6. A wire harness including a plurality of conductive paths each having the conductive path structure according to claim 1 .

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2013
From: ADACHI, HIDEOMI; KUBOSHIMA, HIDEHIKO
To: YAZAKI CORPORATION
Reel/Frame 029876/0981 →