IP Library Granted Patent US 9,328,242
Granted Patent B2
US 9,328,242 · App. 13/819,220 · Granted May 3, 2016

Polysiloxane composition and cured product thereof

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Quick Facts
Patent No.
US 9,328,242
App. No.
13/819,220
Granted
May 3, 2016
Kind
B2
Abstract

The present invention relates to a polysiloxane composition which contains (A) at least one type of organopolysiloxane that contains at least two unsaturated aliphatic hydrocarbon groups in the molecule, (B) at least one type of organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in the molecule, (C) a hydrosilylation reaction catalyst, and (D) inorganic particles which have a major axis to minor axis ratio of 1 to 1.5 and in which the proportion of particles having a diameter of 50 μm or greater is 5 wt. % or less of the total quantity of particles, and which satisfies prescribed conditions. The polysiloxane composition of the present invention has good processability and can provide a hard cured product having an extremely low coefficient of thermal expansion after curing.

Claims (24)

1. A polysiloxane composition comprising:

(A) at least one type of organopolysiloxane that contains at least two unsaturated aliphatic hydrocarbon groups in the molecule,

(B) at least one type of organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in the molecule,

(C) a hydrosilylation reaction catalyst, and

(D) inorganic particles in an amount of from 75 to 95 wt. % based on the total weight of the composition, said inorganic particles comprising 90% by weight or greater of silica and having a major axis to minor axis ratio of 1 to 1.2 and in which the proportion of particles having a diameter of 50 μm or greater is 5 wt. % or less of the total quantity of particles,

wherein

a weight fraction of the unsaturated aliphatic hydrocarbon groups in the organopolysiloxane (A) is from 1 to 7 wt. %,

a compounding ratio of the inorganic particles (D) in the polysiloxane composition is from 70 to 85 vol. %,

a value of [the weight fraction of the unsaturated aliphatic hydrocarbon groups in the organopolysiloxane (A)]×[the weight fraction of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B)] is from 0.04 to 8,

a viscosity of the polysiloxane composition at 25° C. is 500 Pa·s or less, and

the polysiloxane composition provides a cured product having a coefficient of linear expansion at 30 to 300° C. of 80×10 −6 /K or less.

2. The polysiloxane composition according to claim 1 , wherein the viscosity of the organopolysiloxane (A) at 25° C. is from 0.05 to 20 Pa·s.

3. The polysiloxane composition according to claim 1 , wherein the weight fraction of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B) is 0.1 wt. % or greater.

4. The polysiloxane composition according to claim 1 , wherein the viscosity of the organohydrogenpolysiloxane (B) at 25° C. is 0.1 Pa·s or less.

5. The polysiloxane composition according to claim 1 , wherein the value of [the weight fraction of the unsaturated aliphatic hydrocarbon groups in the organopolysiloxane (A)]×[the weight fraction of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B)] is from 0.1 to 7.

6. The polysiloxane composition according to claim 1 , wherein the value of [the weight fraction of the unsaturated aliphatic hydrocarbon groups in the organopolysiloxane (A)]×[the weight fraction of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B)] is from 0.5 to 4.5.

7. The polysiloxane composition according to claim 1 , wherein a value of [the number of moles of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B)]/[the number of moles of the unsaturated aliphatic hydrocarbon groups in the organopolysiloxane (A)] is from 0.5 to 1.5.

8. The polysiloxane composition according to claim 1 , wherein the hydrosilylation reaction catalyst (C) is a platinum metal-type catalyst.

9. The polysiloxane composition according to claim 1 , comprising at least one type of adhesion-imparting agent (E).

10. The polysiloxane composition according to claim 1 , which does not contain a solvent.

11. The polysiloxane composition according to claim 1 , which provides a cured product having a coefficient of linear expansion at 30 to 300° C. of 50×10 −6 /K or less.

12. A cured product obtained by curing the polysiloxane composition described in claim 1 .

13. The polysiloxane composition according to claim 2 , wherein the weight fraction of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane (B) is 0.1 wt. % or greater.

14. A cured product as set forth in claim 12 having a coefficient of linear expansion at 30 to 300° C. of 30×10 −6 /K or less.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2013
From: OGAWA, TAKUYA; SHIBATA, KAZUSATO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 030087/0934 →