Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module
A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.
1. A method for coating an optoelectronic chip-on-board module comprising a flat substrate populated with at least one optoelectronic component, the method comprising the following steps:
a) preheating the flat substrate to be coated to a first temperature;
b) applying on the preheated substrate a dam that encloses at least a partial surface area of the flat substrate to be coated and partially covers a plurality of lateral surfaces and a portion of a top surface of the at least one optoelectronic component, wherein the dam comprises a first, heat-curable, highly reactive first silicone that is cured at the first temperature and is transparent to light that emits from the at least one optoelectronic component;
c) filling the at least partial surface area enclosed by the dam on the flat substrate with a liquid second silicone; and
d) curing the second silicone to form a transparent, UV-resistant, and temperature-resistant coating.
2. The method according to claim 1 , wherein after step b) and before step c), the flat substrate is cooled and/or allowed to cool down to a second temperature lying below the first temperature.
3. The method according to claim 2 , wherein the second temperature lies below a curing temperature of the second silicone.
4. The method according to claim 1 , wherein the second silicone is no more reactive than the first silicone used for generating the dam.
5. The method according to claim 1 , wherein the first silicone and the second silicone comprise the same silicone.
6. The method according to claim 1 , wherein the dam is applied at least in some sections on an edge of the flat substrate.
7. The method according to claim 1 , wherein the dam is applied over optoelectronic components, bonding wires, or other components.
8. The method according to claim 1 , wherein the dam is applied with a cross-sectional profile that causes an optical focusing or scattering of light.
9. The method according to claim 1 , wherein at least one optically functional material is mixed into at least one of the first silicone and the second silicone.
10. The method according to claim 9 , wherein the at least one optically functional material comprises a phosphorescing and/or scattering material or particle.
11. The method according to claim 1 , wherein drops of the first silicone are applied as quickly curing lenses on individual optoelectronic components of the flat substrate.
12. An optoelectronic chip-on-board module produced according to the method of claim 1 .
13. A method for coating an optoelectronic chip-on-board module comprising a substrate provided with at least one optoelectronic component, the method comprising:
a) preheating the substrate to a first temperature;
b) applying to the preheated substrate a material comprising a first, heat-curable and highly reactive first silicone that cures at the first temperature, such that the material begins to cure upon contact with the preheated substrate to form a dam which encloses at least a partial surface area of the preheated substrate and partially covers a plurality of lateral surfaces and a portion of a top surface of the at least one optoelectronic component, wherein the dam is transparent to light that emits from the at least one optoelectronic component;
c) filling the at least partial surface area enclosed by the dam with a liquid second silicone; and
d) curing the second silicone to form a transparent, UV-resistant, and temperature-resistant coating.