IP Library Granted Patent US 9,271,417
Granted Patent B2
US 9,271,417 · App. 13/821,052 · Granted Feb 23, 2016

Electronic component mounting method

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Quick Facts
Patent No.
US 9,271,417
App. No.
13/821,052
Granted
Feb 23, 2016
Kind
B2
Abstract

When a connected position detecting unit detects that a connected position of a tape reaches a predetermined position in the tape passage, head-feeding of an electronic component provided in a head of the connected new tape is provided. In the head-feeding, a tape feeder feeds the tape such that the electronic component in the head of the new tape is located in a component pickup port. When the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage, a mounting head picks up the electronic component from the new tape fed by the head feeding control unit and is mounted on a new board positioned by a board conveying path.

Claims (8)

1. An electronic component mounting method by an electronic component mounting device that comprises: a board conveying path which conveys and positions a board for mounting an electronic component thereon; a tape feeder which feeds pitch by pitch a tape which stores the electronic component is to be mounted on the board so as to supply one by one the electronic component to a component pickup port; a mounting head which picks up the electronic component supplied by the tape feeder to mount the electronic component on the board positioned by the board conveying path; a tape passage serving as a passage of the tape fed pitch by pitch by the tape feeder; and a connected position detecting unit which detects that a connected position where a new tape is connected to the tape provided in the tape feeder reaches a predetermined position in the tape passage,

said electronic component mounting method comprising:

performing head-feeding of the electronic component provided in a head of the connected new tape, in which the tape feeder feeds the tape such that the electronic component in the head of the new tape is located in the component pickup port, when the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage during mounting of the electronic component on a first board; and

after performing head-feeding of the electronic component, picking up the electronic component by the mounting head from the new tape fed by the head feeding control unit and mounting the electronic component on a second board which is different from the first board and positioned by the board conveying path when the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage.

2. An electronic component mounting method by an electronic component mounting device that comprises: a tape feeder which feeds pitch by pitch a tape which stores the electronic component is to be mounted on a board so as to supply one by one the electronic component to a component pickup port; a mounting head which picks up the electronic component supplied by the tape feeder to mount the electronic component on the board; a tape passage serving as a passage of the tape fed pitch by pitch by the tape feeder; and a connected position detecting unit which detects that a connected position where a new tape is connected to the tape provided in the tape feeder reaches a predetermined position in the tape passage,

said electronic component mounting method comprising:

performing head-feeding of the electronic component provided in a head of the connected new tape, in which the tape feeder feeds the tape such that the electronic component in the head of the new tape is located in the component pickup port, when the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage during mounting of the electronic component on a first board; and

after performing head-feeding of the electronic component, picking up the electronic component by the mounting head from the new tape fed by the head feeding control unit and mounting the electronic component on a second board which is different from the first board when the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2013
From: KAWAGUCHI, TEPPEI; MAWATARI, MICHIAKI
To: PANASONIC CORPORATION
Reel/Frame 030470/0553 →