Apparatus and method for depositing a layer onto a substrate
Apparatus ( 1, 26 ) for depositing a layer ( 37, 38, 39 ) on a substrate ( 2 ) in a process gas comprises a chuck ( 3 ) comprising a first surface ( 4 ) for supporting the substrate ( 2 ), a clamp ( 4 ) for securing the substrate ( 2 ) to the first surface ( 14 ) of the chuck ( 3 ), an evacuatable enclosure ( 5 ) enclosing the chuck ( 3 ) and the clamp ( 4 ) and comprising an inlet, through which the processing gas is insertable into the enclosure ( 5 ), and control apparatus ( 19 ). The control apparatus ( 19 ) is adapted to move at least one of the chuck ( 3 ) and the clamp ( 4 ) relative to, and independently of, one another to adjust a spacing between the chuck ( 3 ) and the clamp ( 4 ) during a single deposition process while maintaining a flow of the processing gas and a pressure within the enclosure ( 5 ) that is less than atmospheric pressure.
1. A method for depositing a layer onto a substrate, comprising:
inserting the substrate ( 2 ) into an evacuatable enclosure ( 5 ), and
positioning the substrate ( 2 ) between a clamp ( 4 ) and a chuck ( 3 ) arranged within the enclosure ( 5 ), the chuck ( 3 ) including a cooling circuit for circulating a liquid or a gas through the cooling circuit, and
whilst a pressure within the enclosure ( 5 ) is less than atmospheric pressure:
supplying a processing gas to the enclosure ( 5 );
depositing a first layer ( 37 ) onto a first side the substrate ( 2 ) whilst supplying the processing gas and whilst the first side ( 15 ) of the substrate ( 2 ) is spaced at a distance from the clamp ( 4 ),
bringing the clamp ( 4 ) into direct physical contact with at least a portion of the first layer ( 37 ) deposited on the first side ( 15 ) of the substrate ( 2 ), and
depositing a further layer ( 38 ) onto the first layer ( 37 ) whilst maintaining a supply of the processing gas, whilst maintaining the pressure in the enclosure ( 5 ) at less than atmospheric pressure and whilst the clamp ( 4 ) is in physical contact with the at least a portion of the first layer and secures the substrate ( 2 ) to the chuck ( 3 ),
wherein the clamp ( 4 ) does not contact the first side ( 15 ) of the substrate ( 2 ),
wherein the first layer ( 37 ) is deposited without active cooling of the substrate ( 2 ) by not circulating the liquid or the gas through the cooling circuit, and
wherein the further layer ( 38 ) is deposited with active cooling of the substrate ( 2 ) by circulating the liquid or the gas through the cooling circuit.
2. The method according to claim 1 , further comprising placing the substrate ( 2 ) in contact with a first surface ( 13 ) of the chuck ( 3 ) before depositing the first layer.
3. The method according to claim 1 or claim 2 , further comprising:
placing the substrate ( 2 ) on moveable pins ( 23 ) which protrude above the first surface ( 13 ) of the chuck ( 3 ) and space the substrate ( 2 ) at a distance from the chuck ( 3 ), and
placing the substrate ( 2 ) on the first surface ( 15 ) of the chuck ( 3 ) by retracting the pins ( 23 ).
4. The method according to claim 1 , further comprising:
supporting the clamp ( 4 ) on movable pins ( 24 ),
moving the pins ( 24 ), and
positioning the clamp ( 4 ) spaced at a distance above the first side ( 15 ) of the substrate ( 2 ) during deposition of the first layer ( 37 ).
5. The method according to claim 4 , wherein the clamp ( 4 ) is brought into contact with the first side ( 15 ) of the substrate ( 2 ) by retracting the pins ( 24 ).
6. The method according to claim 1 , wherein the chuck ( 3 ) is movable and the chuck ( 3 ) is moved relative to the clamp ( 4 ) and the clamp ( 4 ) is brought into contact with the first side ( 15 ) of the substrate ( 2 ).
7. The method according to claim 1 , further comprising applying energy to a material source ( 6 ) comprising material to be deposited whereby portions of the material source ( 6 ) are removed, deposited onto the substrate ( 2 ) and form the layer ( 39 ) on the first side ( 15 ) of the substrate ( 2 ).
8. The method according to claim 7 , wherein the portions of the material source ( 6 ) that are removed comprise one or more elements which are deposited onto the substrate ( 2 ) and form a metallic layer on the substrate ( 2 ).
9. The method according to claim 1 , further comprising supplying gaseous material to the enclosure ( 5 ), the gaseous material comprising one or more compounds which react within the enclosure ( 5 ), releasing one or more elements which are deposited onto the substrate ( 2 ) and form the layer ( 39 ).
10. The method according to claim 9 , wherein the one or more elements deposited onto the substrate ( 2 ) form a metallic layer on the substrate ( 2 ).
11. The method according to claim 1 , wherein the substrate ( 2 ) comprises a semiconductor.
12. The method according to claim 11 , wherein the substrate ( 2 ) comprises a semiconductor wafer or a composite comprising semiconductor portions embedded in a plastic matrix.
13. The method according to claim 1 , wherein a thickness of the first layer ( 37 ) is monitored during deposition and the clamp ( 4 ) is brought into contact with the at least a portion of the first layer when the first layer ( 37 ) has a pre-defined thickness.
14. The method according to claim 1 , wherein the first layer ( 37 ) is deposited for a first time span and the further layer ( 38 ) is deposited for a second time span.
15. The method according to claim 14 , wherein the first layer ( 37 ) and the further layer ( 38 ) are deposited over a total time span and the first time span is between 1% and 50% of the total time span.
16. The method according to claim 15 , wherein the first time span is between 10 to 20% of the total time span.