Radiation-emitting component
View Patent ↗The invention relates to a radiation-emitting component comprising a semiconductor body which emits electromagnetic radiation from a radiation exit surface during operation. The semiconductor body is arranged in a component housing having a cutout. The component further comprises an optical element which is connected to the component housing in a mechanically stable manner by means of a joining layer. The modulus of elasticity of the joining layer is lower than or equal to 30 MPa.
1. A radiation-emitting component comprising:
a semiconductor body configured to emit electromagnetic radiation from a radiation exit surface during operation;
a component housing encompassing the semiconductor body, wherein the semiconductor body is arranged in a cutout of the component housing and the cutout of the component housing is filled with a potting; and
an optical element cohesively connected to the component housing by a joining layer,
wherein the joining layer has a modulus of elasticity of less than or equal to 30 MPa,
wherein the optical element has a modulus of elasticity of greater than or equal to 3500 MPa and/or a Shore hardness of greater than or equal to D80, and
wherein the potting has a modulus of elasticity of greater than or equal to 3000 MPa and/or a Shore hardness of greater than or equal to D80, and
wherein the joining layer has a thickness of at least 30 μm.
2. The radiation-emitting component according to claim 1 , wherein the modulus of elasticity of the joining layer is less than or equal to 10 MPa.
3. The radiation-emitting component according to claim 1 , wherein the joining layer has a Shore hardness of less than or equal to A90.
4. The radiation-emitting component according to claim 1 , wherein the joining layer comprises at least one of silicone, an epoxide, a silicone-epoxide hybrid, or polyurethane.
5. The radiation-emitting component according to claim 1 , wherein the joining layer has a thickness of at least 50 μm.
6. The radiation-emitting component according to claim 1 , wherein the optical element comprises at least one of an epoxide, silicone, a silicone-epoxide hybrid, glass, or a thermoplastic.
7. The radiation-emitting component according to claim 1 , wherein the potting comprises at least one of an epoxide, silicone, a silicone-epoxide hybrid, or polyurethane.
8. The radiation-emitting component according to claim 1 , wherein a jump in refractive index between the joining layer and the optical element is less than or equal to 0.3.
9. The radiation-emitting component according to claim 1 , wherein a jump in refractive index between the joining layer and the optical element is less than or equal to 0.1.
10. The radiation-emitting component according to claim 1 , wherein a jump in refractive index between the potting and the joining layer is less than or equal to 0.3.
11. The radiation-emitting component according to claim 1 , wherein a jump in refractive index between the potting and the joining layer is less than or equal to 0.1.
12. The radiation-emitting component according to claim 1 , wherein a main surface of the joining layer runs parallel to the radiation exit surface of the semiconductor body.
13. The radiation-emitting component according to claim 1 , wherein the optical element has a modulus of elasticity of greater than or equal to 3500 MPa.
14. The radiation-emitting component according to claim 1 , wherein the optical element has a Shore hardness of greater than or equal to D80.
15. The radiation-emitting component according to claim 1 , wherein the optical element has a modulus of elasticity of greater than or equal to 3500 MPa and a Shore hardness of greater than or equal to D80.
16. The radiation-emitting component according to claim 1 , wherein the potting has a modulus of elasticity of greater than or equal to 3000 MPa.
17. The radiation-emitting component according to claim 1 , wherein the potting has a Shore hardness of greater than or equal to D80.
18. The radiation-emitting component according to claim 1 , wherein the potting has a modulus of elasticity of greater than or equal to 3000 MPa and a Shore hardness of greater than or equal to D80.
19. A radiation-emitting component comprising:
a semiconductor body configured to emit electromagnetic radiation from a radiation exit surface during operation;
a component housing encompassing the semiconductor body; and
an optical element cohesively connected to the component housing by a joining layer, wherein the joining layer has a modulus of elasticity of less than or equal to Shore A 45,
wherein the optical element has a modulus of elasticity of greater than or equal to 3500 MPa and/or a Shore hardness of greater than or equal to D80,
wherein the potting has a modulus of elasticity of greater than or equal to 3000 MPa and/or a Shore hardness of greater than or equal to D80,
wherein the joining layer has a thickness of at least 50 μm, and wherein the joining layer is of planar fashion in average.
20. The radiation-emitting component according to claim 1 , wherein the joining layer has a constant thickness along a lateral direction.