Electronic component
View Patent ↗An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.
1. An electronic component comprising:
a housing body:
a semiconductor chip arranged in a depression within the housing body, wherein the semiconductor chip is embedded in a potting composed of a first plastic material having a first glass transition temperature; and
a cover element arranged above the depression, wherein the cover element is composed of a second plastic material having a second glass transition temperature, and the second glass transition temperature is lower than the first glass transition temperature,
wherein the first glass transition temperature is in a range between 120° C. and 150° C.; and
wherein the second glass transition temperature is in a range between 80° C. and 120° C.
2. The electronic component according to claim 1 , wherein the first and second plastic materials each comprise a thermosetting plastic.
3. The electronic component according to claim 2 , wherein the first and second plastic materials each comprise an epoxy resin.
4. The electronic component according to claim 1 , wherein the first glass transition temperature is in a range between 120° C. and 150° C.
5. The electronic component according to claim 1 , wherein the second glass transition temperature is in a range between 80° C. and 120° C.
6. The electronic component according to claim 1 , wherein the cover element is arranged on the potting by an adhesive.
7. The electronic component according claim 6 , wherein the adhesive and the cover element have an identical glass transition temperature.
8. The electronic component according to claim 1 , further comprising a leadframe embedded into the housing body, wherein the semiconductor chip is mounted to the leadframe by a connecting material.
9. The electronic component according to claim 1 , wherein the housing body comprises a thermoplastic material.
10. The electronic component according to claim 9 , wherein the thermoplastic material comprises polyphthalamide.
11. The electronic component according to claim 1 , wherein the housing body is surface-mountable.
12. The electronic component according to claim 1 , wherein the semiconductor chip is an optoelectronic semiconductor chip.
13. The electronic component according to claim 12 , wherein the optoelectronic semiconductor chip is a light-emitting semiconductor chip.
14. An electronic component comprising:
a housing body;
a semiconductor chip arranged in a depression within the housing body, wherein the semiconductor chip is embedded into a potting composed of a first plastic material having a first glass transition temperature; and
a cover element arranged above the depression, wherein
the cover element is composed of a second plastic material having a second glass transition temperature,
the first and the second plastic materials comprise and epoxy resin and
the housing body comprises polyphthalamide;
wherein the first glass transition temperature is in a range between 120° C. and 150° C.; and
wherein the second glass transition temperature is in a range between 80° C. and 120° C.
15. The electronic component according to claim 14 , further comprising a leadframe embedded into the housing body, wherein the semiconductor chip is mounted to the leadframe by a connecting material.
16. The electronic component according to claim 14 , wherein the cover element is arranged on the potting by an adhesive.
17. An electronic component comprising:
a housing body;
a semiconductor chip arranged in a depression within the housing body, wherein the semiconductor chip is embedded into a potting composed of a first plastic material having a first glass transition temperature; and
a cover element arranged above the depression, wherein
the cover element is composed of a second plastic material having a second glass transition temperature,
the second glass transition temperature is lower than the first glass transition temperature,
the first glass transition temperature is in a range of between 120° C. and 150° C.; and
the second glass transition temperature is in a range of between 80° C. and 120° C.
18. The electronic component according to claim 17 , wherein the housing body comprises a thermoplastic material.
19. The electronic component according to claim 18 , wherein the thermoplastic material comprises polyphthalamide.
20. The electronic component according to claim 17 , wherein the housing body is surface-mountable.