Thermally conductive resin composition and thermally conductive sheet including the same
A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.
1. A thermally conductive resin composition, comprising:
(A1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 60 to 100 mole %;
(B1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 60 to 100 mole %;
(A2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 0 to 40 mole %;
(B2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 0 to 40 mole %; and
(C) a thermally conductive filler,
said thermally conductive resin composition satisfying, in connection with the content of said fluorine-based compounds (A1), (B1), (A2), and (B2), following Equations [1] to [3]
[( A 1)+( B 1)]/[( A 2)+( B 2)]=20/80 to 80/20 by weight [1]
( A 1)/( B 1)=20/80 to 80/20 by weight [2]
( A 2)/( B 2)=20/80 to 80/20 by weight [3]
said fluorine-based compounds (A1), (B1), (A2), and (B2) have a main chain structure expressed with following Formula [6]
(where n is an integer from 1 to 10).
2. The thermally conductive resin composition according to claim 1 , satisfying, in connection with the content of said fluorine-based compounds (A1), (B1), (A2), and (B2), following Equations [4] and [5]
( A 1)/( B 1)=20/80 to 40/60 or 60/40 to 80/20 by weight [4]
( A 2)/( B 2)=20/80 to 40/60 or 60/40 to 80/20 by weight [5].
3. The thermally conductive resin composition according to claim 1 , wherein
the alkenyl group which said fluorine-based compounds (B1) and (B2) have is a vinyl group.
4. The thermally conductive resin composition according to claim 1 , containing 50 to 500 parts by weight of said thermally conductive filler (C) with respect to a total content of 100 parts by weight of said fluorine-based compounds (A1), (B1), (A2), and (B2).
5. The thermally conductive resin composition according to claim 1 , further comprising (D) a platinum-group-based catalyst.