Method for protecting a cable splice connection with a cover assembly

1. A method for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer, the method comprising:

providing a splice body assembly including:

an electrically insulative, elastomeric splice body having an interior surface defining an interior passage, the splice body including:

a Faraday cage layer including a Faraday cage interface surface forming a part of the interior surface of the splice body defining the interior passage;

a stress cone layer including a stress cone interface surface forming a part of the interior surface of the splice body defining the interior passage; and

a primary insulation layer including a primary insulation interface surface forming a part of the interior surface defining the interior passage, the primary insulation interface layer extending axially from the Faraday cage interface surface to the stress cone interface surface; and

a layer of a conformable medium pre-mounted on the interior surface of the splice body, wherein the conformable medium is pre-mounted on the primary insulation interface surface, wherein the conformable medium is a flowable, electrically insulative material; and

mounting the splice body assembly on the cable splice connection such that the layer of the conformable medium is interposed between and is in direct contact with each of the interior surface of the splice body and an opposing interface surface of the cable insulation layer;

wherein mounting the splice body assembly on the cable splice connection includes mounting the splice body assembly on the splice connection such that the layer of the conformable medium is interposed between and is in direct contact with each of the primary insulation interface surface and the opposing interface surface of the cable insulation at least from the Faraday cage interface surface to the stress cone interface surface.

2. The method of claim 1 including:

providing a pre-expanded splice body assembly including a holdout and the splice body assembly mounted thereon such that the holdout maintains the splice body in an elastically radially expanded state;

wherein mounting the splice body assembly on the splice connection includes positioning the pre-expanded splice body assembly adjacent the cable splice connection and removing the holdout from the splice body assembly to permit the splice body to elastically radially contract onto the cable splice connection.

3. The method of claim 2 wherein the holdout includes a tubular holdout formed by a helically wound strip, and removing the holdout from the splice body assembly includes pulling the strip.

4. The method of claim 1 wherein:

the cable includes a semiconductor layer surrounding the cable insulation layer; and

mounting the splice body assembly on the cable splice connection includes mounting the splice body assembly on the cable splice connection such that the layer of the conformable medium is also interposed between and engages each of the interior surface of the splice body and an opposing interface surface of the semiconductor layer.

5. The method of claim 1 wherein:

the conformable medium is pre-mounted on the Faraday cage interface surface;

the conformable medium is pre-mounted on the stress cone interface surface; and

the method includes mounting the splice body assembly on the cable splice such that:

the layer of the conformable medium is interposed between and engages each of the Faraday cage interface surface and the opposing cable insulation surface; and

the layer of the conformable medium is interposed between and engages each of the stress cone interface surface and the opposing cable insulation surface.

6. The method of claim 1 wherein the layer of the conformable medium extends a distance in the range of from about 50 mm to 70 mm from the Faraday cage interface surface to the stress cone interface surface.

7. The method of claim 1 wherein the layer of the conformable medium has a thickness in the range of from about 0.5 mm to 5 mm following the step of mounting the splice body assembly on the cable splice connection.

8. The method of claim 1 wherein the conformable medium is a mastic.

9. The method of claim 8 wherein the mastic is a silicone rubber-based mastic.

10. The method of claim 8 wherein:

the mastic has an elongation in the range of from about 100% to 400%; and

the mastic has a hardness in the range of up to about Shore A 10.

11. The method of claim 8 wherein the mastic has a dielectric strength in the range of from about 450 Volts/mil to 800 Volts/mil.

12. The method of claim 1 wherein the splice body is formed of silicone rubber.

13. The method of claim 1 wherein, after the splice body assembly is mounted on the cable splice connection, the splice body applies a persistent radially compressive load to the layer of the conformable medium.

14. A method for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer and a semiconductor layer surrounding the cable insulation layer, the method comprising:

providing a splice body assembly including:

an electrically insulative, elastomeric splice body having an interior surface defining an interior passage; and

a layer of a conformable medium pre-mounted on the interior surface of the splice body, wherein the conformable medium is a flowable, electrically insulative material; and

mounting the splice body assembly on the cable splice connection such that the layer of the conformable medium is interposed between and is in direct contact with each of the interior surface of the splice body and an opposing interface surface of the cable insulation layer;

wherein mounting the splice body assembly on the cable splice connection includes mounting the splice body assembly on the cable splice connection such that the layer of the conformable medium is also interposed between and is in direct contact with each of the interior surface of the splice body and an opposing interface surface of the semiconductor layer.

15. The method of claim 14 wherein the conformable medium is a mastic.

16. The method of claim 15 wherein the mastic is a silicone rubber-based mastic.