Patent Application

App. No. 13/828,742

Abstract

Claims (34)

1 . A composition comprising a resin material, exfoliated boron nitride, an optional functionalization additive, and a hard filler material having a hardness greater than the hardness of hexagonal boron nitride, wherein the exfoliated boron nitride is produced in situ by mixing boron nitride crystals with the resin material in the presence of the hard filler.

2 . The composition of claim 1 , wherein the composition comprises from about 5 weight percent to about 60 weight percent of boron nitride; from about 10 weight percent to about 55 weight percent of the hard filler material; from about 0 to about 15 weight percent of the functionalization additive; and from about 20 weight percent to about 75 weight percent of the resin material.

3 . The composition of claim 1 , wherein the composition comprises from about 20 weight percent to about 50 weight percent of boron nitride; from about 20 weight percent to about 50 weight percent of the hard filler material; from about 0.1 to about 5 weight percent of the functionalization additive; and from about 20 weight percent to about 75 weight percent of the resin material.

4 . The composition of claim 1 , comprising from about 15 volume percent to about 50 volume percent of boron nitride.

5 . The composition of claim 1 , wherein the composition comprising the exfoliated boron nitride has a greater number of boron nitride particles than the volume of boron nitride in a composition that is devoid of the hard filler material.

6 . The composition of claim 1 , wherein the exfoliated boron nitride has an average thickness of about 1 micron or less.

7 . The composition of claim 1 , wherein the ratio of hard filler material to boron nitride is at least from about 20:1 to about 1:20 by volume.

8 . The composition of claim 1 , wherein the ratio of hard filler material to boron nitride is at least from about 10:1 to about 1:10 by volume.

9 . The composition of claim 1 , where the boron nitride crystal diameter is greater than 3 microns.

10 . The composition of claim 1 , where the boron nitride graphitization index is less than 4.

11 . The composition of claim 1 , where the boron nitride graphitization index is from about 0.1 to about 4.

12 . The composition of claim 1 , wherein the hard filler material is chosen from zinc oxide, magnesium oxide, silica, alumina, aluminum nitride, silicon nitride, silicon carbide, titania, tungsten carbide, titanium nitride or a combination of two or more thereof, a metal oxide chosen from zinc oxide, magnesium oxide, aluminum oxide, beryllium oxide, yttrium oxide, hafniumoxide, or a combination of two or more thereof; a nitride chosen from aluminum nitride, silicon nitride, cubic boron nitride, or a combination thereof; silica; a carbide chosen from silicon carbide, titanium carbide, tantalum carbide, beryllium carbide, boron carbide, or a combination of two or more thereof; a boride chosen from zirconium boride, titanium diboride, aluminum boride, or a combination of two or more thereof; particles or metals or pure elements chosen from powders, particles, or flakes of aluminum, copper, bronze, brass, boron, silicon, nickel, nickel alloys, tungsten, tungsten alloys, or a combination of two or more thereof; apatite, feldspar, topaz, garnet, andalusite, asbestos, barite, flint fluorite, hematite, pyrite, quartz, perovskite, titanates, silicates, chalcogenide, or a combination of two or more thereof; or a combination of two or more of any of these materials.

13 . The composition of claim 1 , wherein the hard filler material has a Mohs hardness of about 4.5 or greater.

14 . The composition of claim 1 , wherein the hard filler material has a Mohs hardness of from about 2 to about 9.5.

15 . The composition of claim 1 , wherein the functionalization additive is a silane.

16 . The composition of claim 15 , wherein the silane is chosen from a mercaptosilane, a alkacryloxy silane, a vinyl silane, a halo silane, a thicaraboxylate silane, a blocked mercapto silane, or a combination of two or more thereof.

17 . The composition of claim 1 , wherein the functionalization additive is present in an amount of from about 1 weight percent to about 10 weight percent.

18 . The composition of claim 1 comprising a silane as the functionalization additive, wherein the boron nitride, hard filler material, and silane are provided as a blended filler composition comprising a blend of the boron nitride, hard filler material, and the silane.

19 . The composition of claim 18 , wherein the blended composition comprises the silane condensed onto the surface of the blend of the boron nitride and the hard filler material.

20 . The composition of claim 1 having a thermal conductivity of about 5 W/mK or greater.

21 . The composition of claim 1 having a thermal conductivity of from about 5 W/mK to about 15 W/mK.

22 . The composition of claim 1 , wherein the polymer material is chosen from polycarbonate; acrylonitrile butadiene styrene (ABS) (C 8 H 8 C 4 H 6 C 3 H 3 N); polycarbonate/acrylonitrile butadiene styrene alloys (PC-ABS); polybutylene terephthalate (PBT); polyethylene therephthalate (PET); polyphenylene oxide (PPO); polyphenylene sulfide (PPS); polyphenylene ether; modified polyphenylene ether containing polystyrene; liquid crystal polymers; polystyrene; styrene-acrylonitrile copolymer; rubber-reinforced polystyrene; poly ether ketone (PEEK); acrylic resins such as polymers and copolymers of alkyl esters of acrylic and methacrylic acid styrene-methyl methacrylate copolymer; styrene-methyl methacrylate-butadiene copolymer; polymethyl methacrylate; methyl methacrylate-styrene copolymer; polyvinyl acetate; polysulfone; polyether sulfone; polyether imide; polyarylate; polyamideimide; polyvinyl chloride; vinyl chloride-ethylene copolymer; vinyl chloride-vinyl acetate copolymer; polyimides, polyamides; polyolefins such as polyethylene; ultra-high molecular weight polyethylene; high density polyethylene; linear low density polyethylene; polyethylene napthalate; polyethylene terephthalate; polypropylene; chlorinated polyethylene; ethylene acrylic acid copolymers; polyamides, for example, nylon 6, nylon 6,6, and the like; phenylene oxide resins; phenylene sulfide resins; polyoxymethylenes; polyesters; polyvinyl chloride; vinylidene chloride/vinyl chloride resins; and vinyl aromatic resins such as polystyrene; poly(vinylnaphthalene); poly(vinyltoluene); polyimides; polyaryletheretherketone; polyphthalamide; polyetheretherketones; polyaryletherketone, and combinations of two or more thereof.

23 . A method of forming a thermally conductive composition comprising exfoliated boron nitride, the method comprising exfoliating boron nitride crystals in situ by mixing boron nitride crystals and a hard filler material having a hardness greater than the boron nitride crystals in a resin material.

24 . The method of claim 23 , wherein the hard filler material has a Mohs hardness of from about 2 to about 9.5.

25 . The method of claim 23 , wherein the hard filler material is chosen from zinc oxide, magnesium oxide, silica, alumina, aluminum nitride, silicon nitride, silicon carbide, titania, tungsten carbide, titanium nitride or a combination of two or more thereof, a metal oxide chosen from zinc oxide, magnesium oxide, aluminum oxide, beryllium oxide, yttrium oxide, hafnium oxide, or a combination of two or more thereof; a nitride chosen from aluminum nitride, silicon nitride, cubic boron nitride, or a combination thereof; silica; a carbide chosen from silicon carbide, titanium carbide, tantalum carbide, beryllium carbide, boron carbide, or a combination of two or more thereof; a boride chosen from zirconium boride, titanium diboride, aluminum boride, or a combination of two or more thereof; particles or metals or pure elements chosen from powders, particles, or flakes of aluminum, copper, bronze, brass, boron, silicon, nickel, nickel alloys, tungsten, tungsten alloys, or a combination of two or more thereof; apatite, feldspar, topaz, garnet, andalusite, asbestos, barite, flint fluorite, hematite, pyrite, quartz, perovskite, titanates, silicates, chalcogenide, or a combination of two or more thereof; or a combination of two or more of any of these materials.

26 . The method of claim 23 , wherein the hard filler material has a particle size of from about 50 nanometers to about 100 micron.

27 . The method of claim 23 , wherein the boron nitride is present in an amount of from about 5 weight percent to about 60 weight percent of the total composition weight; the hard filler material is present in an amount of from about 10 weight percent to about 55 weight percent of the total composition weight; and the resin material is present in an amount of from about 20 weight percent to about 75 weight percent of the total composition weight.

28 . The method of claim 27 , further comprising adding from about 0.1 to about 5 weight percent of a functionalization additive.

29 . The method of claim 23 , wherein mixing is accomplished using a mixer, a roll, a set of rolls, a kneader, a co-kneader, a Banbury mixer, a single screw extruder, a twin screw extruder, or a combination of two or more thereof.

30 . The method of claim 23 , wherein the boron nitride and hard filler material are provided as a blended filler composition comprising a blend of the boron nitride and the hard filler material.

31 . The method of claim 30 , wherein the blended filler composition further comprises a silane.

32 . The method of claim 31 , wherein the silane is condensed on the surface of the blended filler composition.

33 . The method of claim 31 , wherein the silane is chosen from a mercaptosilane, a alkacryloxy silane, a vinyl silane, a halo silane, a thicaraboxylate silane, a blocked mercapto silane, or a combination of two or more thereof.

34 . The method of claim 30 , wherein the silane is present in an amount of from about 0.1 weight percent to about 6 weight percent.

Assignments (17)