Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
View Patent ↗A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
1. A filler composition comprising a blend of:
a boron nitride;
a metal oxide; and
a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof.
2. The filler composition of claim 1 , wherein the boron nitride is present in an amount of from about 5 weight percent to about 98 weight percent; the metal oxide is present in an amount of from about 5 weight percent to about 80 weight percent; and the silane is present in an amount of from about 0.1 weight percent to about 6 weight percent.
3. The filler composition of claim 1 wherein the boron nitride is present in an amount of from about 30 weight percent to about 55 weight percent; the metal oxide in is present an amount of from about 20 weight percent to about 50 weight percent; and the silane is present in an amount of from about 1 weight percent to about 3.5 weight percent.
4. The filler composition of claim 1 , wherein the boron nitride is chosen from boron nitride particles, boron nitride agglomerates, or a mixture thereof.
5. The filler composition of claim 1 , wherein the boron nitride comprises platelets having a particle size of 0.3 microns to about 200 microns.
6. The filler composition of claim 1 , wherein the boron nitride comprises boron nitride agglomerates having a mean particle size of from about 5 microns to about 500 microns.
7. The filler composition of claim 1 , wherein the metal oxide is chosen from zinc oxide, aluminum oxide, aluminum nitride, magnesium oxide, beryllium oxide, titanium dioxide, zirconium oxide, yttrium oxide, hafnium oxide, or a combination of two or more thereof.
8. The filler composition of claim 1 , wherein the silane further comprises a silane chosen from an alkacryloxy silane, a vinyl silane, a halo silane, a mercapto silane, or a combination of two or more thereof.
9. The filler composition of claim 8 , wherein the silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane; trichlorododecyl silane, or a combination of two or more thereof.
10. The filler composition of claim 1 further comprising an additional filler component chosen from glass fibers, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, clays, exfoliated clays, alumina, aluminum nitride, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, or a combination of two or more thereof, fibers or whiskers of carbon, graphite, aluminum, copper, bronze, brass, silicon carbide, silicon nitride, aluminum nitride, alumina, zinc oxide, or a combination of two or more thereof, carbon nanotubes, graphene, boron nitride nanotubes, boron nitride nanosheets, zinc oxide nanotubes, or a combination of two or more thereof.
11. The filler composition of claim 1 further comprising glass fiber or glass flake in an amount of from about 2 weight percent to about 30 weight percent.
12. The filler composition of claim 1 , wherein the silane is condensed on the surface of blend of the boron nitride and the metal oxide.
13. The filler composition of claim 1 , wherein the filler has a color on the L*, a*, b* scale with L* greater than 90, a* of −1.3 to 1.3, and b* of −2.5 to 2.5.
14. A thermally conductive composition comprising:
a resin material; and
a thermally conductive filler composition dispersed in the polymer material, wherein the thermally conductive filler composition comprises a blend of a boron nitride, a metal oxide, and a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof, and the thermally conductive composition has an in-plane thermal conductivity of about 2 W/mK or greater, a through-plane thermal conductivity of about 0.9 W/mK or greater, or both.
15. The composition of claim 14 having an in-plane thermal conductivity of 3.5 W/mK or greater.
16. The composition of claim 14 having an in-plane thermal conductivity of 5 W/mK or greater.
17. The composition of claim 14 comprising a total thermally conductive filler concentration of about 58% by weight or less of the total weight of the composition.
18. The composition of claim 14 having a total thermally conductive filler content of about 40% or less by volume (v/v) of the composition.
19. The composition of claim 14 , comprising a boron nitride concentration of about 41 wt. % or less of the composition.
20. The composition of claim 14 , comprising a boron nitride concentration of about 20 wt. % to about 60 wt. % of the composition.
21. The composition of claim 14 , wherein in the thermally conductive filler composition, the boron nitride is present in an amount of from about 5 weight percent to about 75 weight percent; the metal oxide is present in an amount of from about 5 weight percent to about 80 weight percent; and the silane is present in an amount of from about 0.1 weight percent to about 6 weight percent.
22. The composition of claim 14 , wherein the boron nitride is chosen from boron nitride particles, boron nitride agglomerates, or a mixture thereof.
23. The composition of claim 14 , wherein the metal oxide is chosen from zinc oxide, magnesium oxide, beryllium oxide, titanium dioxide, zirconium oxide, yttrium oxide, hafnium oxide, or a combination of two or more thereof.
24. The composition of claim 14 , wherein the silane further comprises a second silane chosen from an alkacryloxy silane, a vinyl silane, a halo silane, a mercapto silane, or a combination of two or more thereof.
25. The composition of claim 24 , wherein the silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane; trichlorododecyl silane, or a combination of two or more thereof.
26. The composition of claim 14 , wherein the thermally conductive filler composition further comprises an additional filler component chosen from glass fibers, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, clays, exfoliated clays, alumina, aluminum nitride, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, or a combination of two or more thereof, fibers or whiskers of carbon, graphite, aluminum, copper, bronze, brass, silicon carbide, silicon nitride, aluminum nitride, alumina, zinc oxide, or a combination of two or more thereof, carbon nanotubes, graphene, boron nitride nanotubes, boron nitride nanosheets, zinc oxide nanotubes, or a combination of two or more thereof.
27. The filler composition of claim 14 , wherein the thermally conductive filler composition further comprises glass fiber or glass flake in an amount of from about 0 weight percent to about 60 weight percent.
28. The composition of claim 14 , wherein the in-plane thermal conductivity is at least 10 W/mK.
29. The composition of claim 14 having a notched Izod impact value of 20 J/m or greater.
30. The composition of claim 14 having a tensile strength value of about 6500 psi or greater.
31. A shaped article formed by the composition of claim 14 .
32. A thermal management assembly comprising the shaped article of claim 29 .
33. A filler composition comprising a blend of:
from about 5 weight percent to about 98 weight percent of a boron nitride;
from about 5 weight percent to about 80 weight percent of a metal oxide;
from about 0.1 weight percent to about 60 weight percent of glass fiber, glass flake, or a combination thereof;
and from about 0.1 weight percent to about 6 weight percent or a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof.
34. The filler composition of claim 33 , wherein
the boron nitride is chosen from boron nitride particles, boron nitride agglomerates, or a combination thereof;
the metal oxide is chosen from zinc oxide, magnesium oxide, beryllium oxide, titanium dioxide, zirconium oxide, yttrium oxide, aluminum oxide, hafnium oxide, or a combination of two or more thereof; and
the silane comprises a second silane chosen from an alkacryloxy silane, a vinyl silane, a halo silane, a mercapto silane, or a combination of two or more thereof.
35. The composition of claim 34 , wherein the silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane; trichlorododecyl silane, or a combination of two or more thereof.
36. The filler composition of claim 33 , wherein the boron nitride is present in an amount of from about 30 weight percent to about 55 weight percent; the metal oxide in is present an amount of from about 20 weight percent to about 50 weight percent; the silane is present in an amount of from about 1 weight percent to about 3.5 weight percent; and the glass fiber and/or glass flake is present in an amount of from about 1 weight percent to about 10 weight percent.
37. The filler composition of claim 33 , wherein the silane is condensed onto the blend of the boron nitride and the metal oxide.
38. A thermally conductive composition comprising (a) a resin material; and (b) the filler composition of claim 33 .
39. A filler composition comprising a blend of a boron nitride and a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof.
40. The filler composition of claim 39 , wherein the silane further comprises a silane chosen from alkacryloxy second silane, a vinyl silane, a halo silane, a mercapto silane, or a combination of two or more thereof.
41. The filler composition of claim 40 , wherein the second silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane; trichlorododecyl silane, or a combination of two or more thereof.
42. The filler composition of claim 39 comprising the silane in an amount of from about 0.1 weight percent to about 6 weight percent of the total filler weight.
43. The filler composition of claim 39 , wherein the boron nitride is chosen from boron nitride particles, boron nitride agglomerates, or a combination thereof.
44. The filler composition of claim 39 , wherein the boron nitride comprises platelets having a particle size of about 0.3 microns to about 200 microns.
45. The filler composition of claim 39 , wherein the boron nitride comprises boron nitride agglomerates having a mean particle size of from about 5 microns to about 500 microns.
46. A thermally conductive composition comprising the filler composition of claim 36 .
47. A method of making a blended filler composition comprising blending boron nitride with a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof, and heat treating the blend.
48. The method of claim 47 comprising heating at a temperature of at least about 50° C.
49. The method of claim 47 , wherein the one or more filler materials comprises a boron nitride and a metal oxide.
50. The method of claim 47 , wherein the silane further comprises a silane chosen from an alkacryloxy silane, a vinyl silane, a halo silane, a mercapto silane, or a combination of two or more thereof.
51. The method of claim 50 , wherein the silane is chosen from 3-octanoylthio-1-propyltriethoxy silane; vinyl tris(2-methoxy-ethoxy)silane; gamma-methacryloxypropyltreimethoxy silane; trichlorododecyl silane, or a combination of two or more thereof.
52. The composition of claim 14 with a dielectric strength of at least 250 V/mil.
53. The composition of claim 14 with a volume resistivity of at least 10 12 Ohm-cm.
54. The composition of claim 14 with a density less than 1.7 g/cc.
55. A thermally conductive composition comprising:
a polycarbonate resin material; and
a thermally conductive filler composition dispersed in the polymer material, wherein the thermally conductive filler composition comprises a blend of a boron nitride and a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, methacryloxy silane or a combination thereof, and the thermally conductive composition has an in-plane thermal conductivity of about 2 W/mK or greater, a through-plane thermal conductivity of about 0.9 W/mK or greater, or both.
56. The composition of claim 55 where the filler further comprises a metal oxide.
57. A thermally conductive composition comprising:
a polyamide resin material; and
a thermally conductive filler composition dispersed in the polymer material, wherein the thermally conductive filler composition comprises a blend of a boron nitride and a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, halosilane or a combination thereof, and the thermally conductive composition has an in-plane thermal conductivity of about 2 W/mK or greater, a through-plane thermal conductivity of about 0.9 W/mK or greater, or both.
58. The composition of claim 56 where the filler further comprises a metal oxide.