Plated terminations
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.
1. A method of forming plated terminations on a multi-layer electronic component using a self-determining process, comprising the steps of:
providing electrode layers, and providing dielectric layers which are respectively interleaved with said electrode layers and which otherwise form an insulative substrate;
exposing selected portions of said electrode layers; and
plating termination material on the exposed portions of said electrode layers using said exposed portions of said electrode layers as nucleation points and guides for the termination material;
wherein said plating termination material step comprises electrolessly plating, wherein said electrolessly plating comprises depositing a first layer and a second layer by electrolessly plating, wherein said electrolessly plating further includes covering the first layer with an electrically resistive polymeric material before depositing the second layer.
2. A method of forming plated terminations on a multi-layer electronic component using a self-determining process, comprising the steps of:
providing electrode layers, and providing dielectric layers which are respectively interleaved with said electrode layers and which otherwise form an insulative substrate;
exposing selected portions of said electrode layers; and
plating termination material on the exposed portions of said electrode layers using said exposed portions of said electrode layers as nucleation points and guides for the termination material;
wherein said plating termination material step comprises electrolessly plating, wherein said electrolessly plating comprises depositing a first layer by electrolessly plating, wherein the step of depositing the first layer comprises submersing the multi- layer electronic component in an electroless copper plating solution to form a copper termination layer, further comprising the step of plating the copper termination layer with an electrically resistive layer.
3. A method as in claim 2 , further comprising the step of plating the electrically resistive layer with a conductive layer.
4. A method of forming plated terminations on a multi-layer electronic component using a self-determining process, comprising the steps of:
providing electrode layers, and providing dielectric layers which are respectively interleaved with said electrode layers and which otherwise form an insulative substrate;
exposing selected portions of said electrode layers; and
electrolessly plating termination material on the exposed portions of said electrode layers using said exposed portions of said electrode layers as nucleation points and guides for the termination material;
wherein said electrolessly plating termination material step comprises electrolessly plating a first metal layer and then repeated electrolessly plating a second metal layer of other metal, wherein said electrolessly plating further includes covering the first layer with an electrically resistive polymeric material before plating the second layer.