EMBOSSED MICRO-STRUCTURE WITH CURED TRANSFER MATERIAL
An embossed micro-structure includes an emboss substrate having a cured emboss layer formed thereon. The cured emboss layer has a cured-layer surface opposite the substrate and one or more micro-channels embossed in the cured emboss layer extending from the cured-layer surface into the cured emboss layer toward the substrate. A cured transfer material is located on, in, or beneath the micro-channels.
1 . An embossed micro-structure, comprising:
an emboss substrate;
a cured emboss layer formed on the emboss substrate, the cured emboss layer having a cured-layer surface opposite the substrate and one or more micro-channels embossed in the cured emboss layer extending from the cured-layer surface into the cured emboss layer toward the substrate; and
a cured transfer material on, in, or beneath the micro-channels.
2 . The embossed micro-structure of claim 1 , wherein the cured transfer material is also located on or in one or more sides of the micro-channels.
3 . The embossed micro-structure of claim 1 , wherein the cured emboss layer and the cured transfer material both include a common curable material.
4 . The embossed micro-structure of claim 1 , wherein the cured transfer material includes a dye or pigment.
5 . The embossed micro-structure of claim 1 , wherein the cured transfer material is light-absorbing.
6 . The embossed micro-structure of claim 1 , wherein the cured transfer material is substantially black or gray.
7 . The embossed micro-structure of claim 1 , wherein the transfer material and the emboss layer include cross linked polymers and the cured transfer material is cross linked to the cured emboss layer.
8 . The embossed micro-structure of claim 1 , further including a cured electrical conductor in the micro-channels forming a micro-wire.
9 . The embossed micro-structure of claim 8 , wherein the cured electrical conductor includes electrically conductive nano-particles.
10 . The embossed micro-structure of claim 9 , wherein the electrically conductive nano-particles are sintered, welded, or agglomerated together.
11 . The embossed micro-structure of claim 9 , wherein the electrically conductive nano-particles include metal, metal alloys, or particles with a metal or metal alloy shell.
12 . The embossed micro-structure of claim 8 , wherein the cured electrical conductor is porous.
13 . The embossed micro-structure of claim 8 , wherein the cured electrical conductor includes silver.
14 . The embossed micro-structure of claim 1 , wherein the depth of the micro-channel is in the range of about ten microns to two microns.
15 . The embossed micro-structure of claim 1 , wherein the width of the micro-channel is in the range of about twelve microns to two microns.
16 . The embossed micro-structure of claim 1 , wherein the thickness of the single cured emboss layer is in the range of about twelve microns to four microns.
17 . The embossed micro-structure of claim 1 , wherein the cured electrical conductor is adhered to the transfer material or the cured emboss layer.
18 . The embossed micro-structure of claim 1 , wherein the transfer material is optically diffusive.