Dispensible electrical gasket, electronic module having dispensible electrical gasket, and method of fabricating same
View Patent ↗An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions. An electrical gasket is formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.
1. An electronic module, comprising:
a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface;
a housing element for mechanically mating with the PCB, the housing element comprising at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions; and
an electrical gasket formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.
2. The electronic module of claim 1 , wherein the electronic module is an automotive radar sensor module.
3. The electronic module of claim 1 , wherein the housing element is formed of a material comprising metal.
4. The electronic module of claim 3 , wherein the metal is aluminum.
5. The electronic module of claim 1 , wherein the housing element is formed of a plastic material.
6. The electronic module of claim 5 , wherein the housing element comprises a conductive coating.
7. The electronic module of claim 6 , wherein the conductive coating is conductive paint.
8. The electronic module of claim 1 , wherein the electrical gasket comprises a soft conductive elastomer material.
9. The electronic module of claim 1 , wherein the protrusions and spaces on the mating surface of the housing element have a sawtooth pattern.
10. The electronic module of claim 1 , wherein the protrusions and spaces on the mating surface of the housing element have a substantially rectangular shape.
11. The electronic module of claim 1 , wherein the protrusions and spaces on the mating surface of the housing element have a substantially trapezoidal shape.
12. A method of making an electronic module, comprising:
forming at least one conductive trace on a surface of a printed circuit board (PCB);
forming at least one mating surface on a housing element for mechanically mating with the PCB, the at least one mating surface being formed to be aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface being formed with a plurality of alternating protrusions and spaces between the protrusions; and
forming an electrical gasket on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.
13. The method of claim 12 , wherein the electronic module is an automotive radar sensor module.
14. The method of claim 12 , wherein the housing element is formed of a material comprising metal.
15. The method of claim 14 , wherein the metal is aluminum.
16. The method of claim 12 , wherein the housing element is formed of a plastic material.
17. The method of claim 16 , further comprising applying a conductive coating to at least a portion of the housing element.
18. The method of claim 17 , wherein the conductive coating is conductive paint.
19. The method of claim 11 , wherein the electrical gasket comprises a soft conductive elastomer material.
20. The method of claim 12 , wherein forming the electrical gasket comprises:
dispensing a fluid gasket material onto the mating surface of the housing element such that the fluid gasket material conforms with the protrusions and spaces on the mating surface of the housing element; and
allowing the fluid gasket material to dry to a solid gasket material.
21. The method of claim 12 , wherein forming the at least one mating surface on the housing comprises molding the mating surface while molding the housing.
22. The method of claim 12 , wherein the protrusions and spaces on the mating surface of the housing element are formed in a sawtooth pattern.
23. The method of claim 12 , wherein the protrusions and spaces on the mating surface of the housing element are formed to have a substantially rectangular shape.
24. The method of claim 12 , wherein the protrusions and spaces on the mating surface of the housing element are formed to have a substantially trapezoidal shape.