IP Library Granted Patent US 9,108,301
Granted Patent B2
US 9,108,301 · App. 13/836,155 · Granted Aug 18, 2015

Delayed diffusion of novel species from the back side of carbide

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Quick Facts
Patent No.
US 9,108,301
App. No.
13/836,155
Granted
Aug 18, 2015
Kind
B2
Abstract

A polycrystalline diamond compact (PDC) is fabricated using a process of delayed diffusion of a diffusion species (e.g., a metalloid) introduced from the back side of a cemented carbide further away from the diamond grit or from the flank side of the cemented carbide, as opposed to the side of the cemented carbide adjacent to the diamond grit. The process of fabricating the PDC includes depositing, in a metal container, a diamond grit, a cemented carbide, and a diffusion species, then applying a high pressure and high temperature (HPHT) to the contents of the metal container wherein (1) the binder of cemented carbide diffuses across the diamond grit, and (2) the diffusion species diffuses through the cemented carbide, and then through the diamond grit, thus providing a protective coating to the diamond grains of the PDC.

Claims (21)

1. A process of fabricating a polycrystalline diamond compact (PDC), comprising:

depositing, in a metal container, an amount of a diamond grit;

depositing, in the metal container, an amount of a cemented carbide having a binder content adjacent to the diamond grit;

depositing, in the metal container, an amount of a diffusion species, such that the diffusion species is spaced apart from the diamond grit by the cemented carbide; and

applying a high pressure and high temperature to the diamond grit, the cemented carbide, and the diffusion species,

wherein the binder content in the cemented carbide infiltrates across the diamond grit firstly, and

wherein the diffusion species diffuses across the cemented carbide and then the diamond grit secondly.

2. The process of claim 1 , wherein the metal container includes at least one of tantalum (Ta) or molybdenum (Mo).

3. The process of claim 1 , wherein the diffusion species includes a metalloid.

4. The process of claim 1 , further comprising increasing thermal stability of the cemented carbide by incorporating the diffusion species.

5. The process of claim 1 , wherein the cemented carbide is sandwiched between the diamond grit and the diffusion species.

6. The process of claim 1 , wherein the cemented carbide has a top surface and a flank surface, wherein the top surface is attached to and circumscribed by the flank surface.

7. The process of claim 6 , wherein the diffusion species is disposed close to the flank surface and parallel to the flank surface of the cemented carbide.

8. The process of claim 1 , further comprising finishing the polycrystalline diamond compact into a desired final dimension.

9. The process of claim 3 , wherein the metalloid includes at least one of silicon (Si), cobalt silicide (CoSi), Cr, Ti, V, Zr, Mo, W, Nb, Sc, Y, Ta, B, and Ru.

10. The process of claim 4 , further comprising increasing corrosion resistance, erosion resistance, and wear resistance of the cemented carbide by incorporating the diffusion species.

11. The process of claim 1 , wherein the amount of diamond grit is approximately from about 1.0 g to about 3.0 g.

12. The process of claim 1 , wherein the amount of cemented carbide has a thickness from about 2 mm to about 20 mm.

13. The process of claim 1 , wherein the amount of the diffusion species has a thickness approximately from about 0.01 mm to about 1 mm.

14. The process of claim 8 , wherein the finishing step includes at least one of grinding, lapping, turning, polishing, bonding, heating, and chamfering.

15. The process of claim 1 , further comprising causing the sintered diamond layer to have a lower coefficient of thermal expansion in the pore spaces between diamond grains.

Assignments (5)
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →