Integrated circuit and operation method thereof
View Patent ↗An integrated circuit of a multiple die package structure having a plurality of semiconductor devices, each of the plurality of semiconductor devices may include an active termination circuit configured to perform an active termination operation to the semiconductor device, and to be turned off in a disable state of an active termination setting code, a multiple die package information transfer unit configured to transfer a multiple die package information signal, and a compulsory termination unit configured to selectively convert the active termination setting code into the disable state in response to the multiple die package information signal.
1. An integrated circuit of a multiple die package structure having a plurality of semiconductor devices, each of the plurality of semiconductor devices comprising:
an active termination circuit configured to perform an active termination operation to the semiconductor device, and to be turned off according to a disable state of an active termination setting code;
a multiple die package information transfer unit configured to transfer a multiple die package information signal; and
a compulsory termination unit configured to selectively convert the active termination setting code into the disable state in response to the multiple die package information signal.
2. The Integrated circuit of claim 1 , wherein the active termination setting code indicates the disable state when the active termination setting code is set to a predetermined value.
3. The Integrated circuit of claim 2 , wherein the compulsory termination unit converts the active termination setting code into the predetermined value in response to an enable state of the multiple die package information signal.
4. The integrated circuit of claim 1 , wherein the multiple die package information signal transfer unit outputs the multiple die package information signal as a signal, which is applied from a predetermined pad.
5. The integrated circuit of claim 1 , wherein the multiple die package information signal transfer unit outputs the multiple die package information signal as a signal, and a logic level of the signal is determined by a predetermined fuse circuit.
6. The integrated circuit of claim 1 , wherein the active termination circuit is turned off at the disable state and does not perform any operation if the active termination setting code is set to a predetermined value, and is turned on at an enable state and adjust a termination resistance value in response to a value of the active termination setting code if the active termination setting code is not set to a predetermined value.
7. The integrated circuit of claim 6 , wherein the compulsory termination unit controls the active termination circuit to not perform any operation by converting the active termination setting code into the predetermined value in response to an enable state of the multiple die package information signal.
8. An operation method of each of a plurality of semiconductor devices included in an integrated circuit of a multiple die package structure, wherein each of the plurality of semiconductor devices includes an active termination circuit that performs an active termination operation to the semiconductor device and is controlled by an active termination setting code, the operation method comprising:
determining an enable state of a multiple die package information signal;
turning off the active termination circuit by converting the active termination setting code into a disable state, if the multiple die package information signal is enabled;
performing the active termination operation according to the active termination setting code, if the multiple die packaging information signal is disabled.
9. The operation method of claim 8 , wherein the active termination setting code indicates the disable state when the active termination setting code is set to a predetermined value.
10. The operation method of claim 9 , wherein the turning off of the active termination circuit converts the active termination setting code into the predetermined value in response to the enable state of the multiple die package information signal.
11. The operation method of claim 8 , wherein the determining of the enable state determines the enable state of the multiple die package information signal in response to an activation of a signal that is applied to a predetermined pad of the corresponding semiconductor device.
12. The operation method of claim 8 , wherein the determining of the enable state determines the enable state of the multiple die package information signal in response to an activation of a signal outputted from a predetermined fuse circuit.