Protective film
A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.
1. A protective film comprising:
a) a base layer comprising a soluble polyimide polymer, wherein the soluble polyimide polymer is 6FDA-BDAF and comprises titanium dioxide encased in silicon dioxide incorporated therein and where the base layer comprises a base layer exterior surface, a base layer thickness, and a base layer length, where the base layer thickness is less than 12 microns and the base layer length is at least 2 meters; and
b) an exterior layer directly contacting the base layer exterior surface, where the exterior layer comprises a fluorinated polymeric layer, wherein the fluorinated polymeric layer is selected from the group consisting of a fluorinated ethylene polymer, a fluoroethylene alkyl polymer ether, an ethylene chlorotrifluoro polymer and a polyvinyl fluoride polymer;
wherein (i) the protective film is adhered to a substrate by thermal bonding, diffusion welding or ultrasonic welding and (ii) Wherein at least one of the base layer or exterior layer comprises an indium-tin-oxide layer.
2. The protective film of claim 1 where the exterior layer further comprises an outermost exterior layer most distant from the base layer, and where the outermost exterior layer comprises a dielectric material.
3. The protective film of claim 1 where the base layer comprises a base layer interior surface opposite the base layer exterior surface, the protective film further comprising an interior layer directly contacting the base layer interior surface, where the interior layer comprises a metalloid layer.
4. The protective film of claim 3 wherein the protective film forms at least a portion of an airship.
5. The protective film of claim 1 where exterior layer comprises a reflective pigment.
6. The protective film of claim 1 wherein the protective film has a surface electrical resistivity of no more than 10 11 ohms per square.
7. The protective film of claim 1 wherein the protective film has a bulk electrical resistivity of no more than 10 11 ohm-cm.
8. The protective film of claim 1 where the exterior layer comprises a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than three percent, and where each dielectric layer has a different index of refraction than any directly adjacent dielectric layers.
9. The protective film of claim 1 further comprising a carrier film removably connected to the protective fill.
10. The protective film of claim 1 comprising a total film thickness less than 14 microns.
11. The protective film of claim 1 where the protective film comprises a protective film exterior surface, the protective film having a thermal emissivity greater than a solar absorptivity from the protective film exterior surface.
12. A protective film comprising:
a a base layer comprising a soluble polyimide polymer and titanium dioxide encased in silicon dioxide where the base layer comprises a base layer exterior surface, a base layer thickness, and a base layer length, where the base layer thickness is less than 12 microns and the base layer length is at least 2 meters; and
b an exterior layer directly contacting the base layer exterior surface, where the exterior layer comprises a fluorinated polymeric layer, wherein the fluorinated polymeric layer is selected from the group consisting of a fluorinated ethylene polymer, a fluoroethylene alkyl polymer ether, an ethylene chlorotrifluoro polymer and a polyvinyl fluoride polymer;
wherein at least one of the base or exterior layers comprise an indium-tin-oxide layer.