Systems and methods for encapsulating electronics in a mountable device
View Patent ↗A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
1. A mountable device, comprising:
a polymer, wherein the polymer defines at least one mounting surface of the mountable device; and
a bio-compatible structure embedded in the polymer, wherein the bio-compatible structure comprises:
a first layer of bio-compatible material;
an integrated circuit disposed on the first layer of bio-compatible material, wherein the integrated circuit has a first surface adhered to the first layer of bio-compatible material and a second surface opposite the first surface, wherein the second surface of the integrated circuit includes electrical contacts;
a second layer of bio-compatible material disposed on the first layer of bio-compatible material, wherein the second layer of bio-compatible material has a surface that is substantially flush with the second surface of the integrated circuit;
sensor electrodes and electrical interconnects between the sensor electrodes and the electrical contacts, wherein the sensor electrodes and electrical interconnects are disposed on the surface of the second layer of bio-compatible material; and
a third layer of bio-compatible material disposed on the second layer of bio-compatible material, wherein the integrated circuit is fully encapsulated by the first, second, and third layers of bio-compatible material.
2. The mountable device of claim 1 , wherein the bio-compatible structure further comprises an antenna and electrical interconnects between the antenna and additional electrical contacts on the second surface of the integrated circuit.
3. The mountable device of claim 1 , wherein the bio-compatible structure has a thickest portion that is less than 100 micrometers thick.
4. The mountable device of claim 1 , wherein the first, second, and third layers of bio-compatible material are annealed together.
5. The mountable device of claim 1 , wherein the third layer of bio-compatible material covers the integrated circuit and has an opening that exposes at least a portion of the sensor electrodes.
6. The mountable device of claim 1 , further comprising a reagent layer proximal to the sensor electrodes.
7. The mountable device of claim 1 , wherein the bio-compatible structure is ring shaped.
8. The mountable device of claim 1 , wherein the bio-compatible material comprises parylene.
9. The mountable device of claim 1 , wherein the mountable device comprises an eye-mountable device and the at least one mounting surface comprises a concave surface configured to mount the eye-mountable device to a corneal surface.