SYSTEM PROVIDED WITH A SOLDER JOINT
A system provided with a solder joint includes: a circuit board ( 101 ) provided with an aperture ( 102 ), an electrical component ( 103 ) including a conductor foot ( 104 ) protruding through the aperture, and soldering metal ( 105 ) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element ( 106 ) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.
1 . A system provided with a solder joint, the system comprising:
a circuit board provided with an aperture,
an electrical component comprising a conductor foot protruding through the aperture, and
soldering metal inside the aperture and in contact with the conductor foot
wherein the system further comprises a thermal conductor element being a metal wire and comprising a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal, the thermal conductor element being capable of conducting heat to/from the aperture and at least a part of the first portion of the thermal conductor element being separate with respect to the conductor foot of the electrical component.
2 . A system according to claim 1 , wherein the thermal conductor element is separate with respect to the conductor foot of the electrical component.
3 . A system according to claim 1 , wherein the first portion of the thermal conductor element is located on a same side of the circuit board as the electrical component.
4 . A system according to claim 2 , wherein the first portion of the thermal conductor element is located on a same side of the circuit board as the electrical component.
5 . A system according to claim 1 , wherein the first portion of the thermal conductor element is located on an opposite side of the circuit board with respect the electrical component.
6 . A system according to claim 2 , wherein the first portion of the thermal conductor element is located on an opposite side of the circuit board with respect the electrical component.
7 . A system according to claim 1 , wherein the thermal conductor element further comprises a third portion outside the aperture and located on an opposite side of the circuit board with respect to the first portion of the thermal conductor element.
8 . A system according to claim 2 , wherein the thermal conductor element further comprises a third portion outside the aperture and located on an opposite side of the circuit board with respect to the first portion of the thermal conductor element.
9 . A system according to claim 1 , wherein the first portion of the thermal conductor element is branching from the conductor foot and wherein a part of the conductor foot located in the aperture constitutes the second portion of the thermal conductor element.
10 . A system according to claim 1 , wherein the length of the first portion of the thermal conductor element is at least three times the thickness of the circuit board.
11 . A system according to claim 1 , wherein the soldering metal comprises tin.
12 . A system according to claim 1 , wherein the thermal conductor element comprises copper.
13 . An electronic device comprising a system provided with a solder joint, the system comprising:
a circuit board provided with an aperture,
an electrical component comprising a conductor foot protruding through the aperture, and
soldering metal inside the aperture and in contact with the conductor foot
wherein the system further comprises a thermal conductor element being a metal wire and comprising a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal, the thermal conductor element being capable of conducting heat to/from the aperture and at least a part of the first portion of the thermal conductor element being separate with respect to the conductor foot of the electrical component.
14 . An electronic device according to claim 13 , wherein the electronic device is at least one of the following: an internet protocol “IP” router, an Ethernet switch, a multiprotocol label switching “MPLS” switch.
15 . A method for making a solder joint, the method comprising:
installing a conductor foot of an electrical component through an aperture of a circuit board, and
letting molten soldering metal to be absorbed into the aperture,
wherein the method comprises, prior to the letting the molten soldering metal to be absorbed into the aperture:
installing a thermal conductor element so that a first portion of the thermal conductor element is left outside the aperture and a second portion of the thermal conductor element gets inside the aperture, at least a part of the first portion of the thermal conductor element being separate with respect to the conductor foot of the electrical component, and
directing heat to the thermal conductor element so as to conduct heat to the aperture.
16 . A method for making a solder joint, the method comprising:
installing a conductor foot of an electrical component in an aperture of a circuit board and bending the conductor foot so that a part of the conductor foot gets at least doubly in the aperture, and
letting molten soldering metal to be absorbed into the aperture,
wherein the method comprises, prior to the letting the molten soldering metal to be absorbed into the aperture:
directing heat to the conductor foot so as to conduct heat to the aperture.