ELECTRONIC APPARATUS AND PRINTED WIRING BOARD
According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.
1 . An electronic device comprising:
a case comprising a ground portion;
a printed wiring board comprising an edge portion and a fixing hole located adjacent to the edge portion, the printed wiring board being housed in the case;
a land provided at a position outside an area extending along the edge portion, the area including a portion between the edge portion and the fixing hole, the land comprising a part extending from a vicinity of the edge portion along the edge portion;
a conductive plating portion covering an inner surface of the fixing hole, the conductive plating portion being provided to be continuous with the land; and
a screw being screwed in the fixing hole and electrically connecting the ground portion and the land.
2 . The device of claim 1 ,
wherein the part of the land extending from the vicinity of the edge portion along the edge portion is configured to be located more toward the edge portion with respect to a center of the fixing hole.
3 . The device of claim 2 ,
wherein the printed wiring board comprises a first face that is provided with the land and a second face that is opposite the first face, and wherein the conductive plating portion is configured to extend across the first face and the second face.
4 . The device of claim 3 ,
wherein the printed wiring board comprises a second land that is provided on the second face to be continuous with the conductive plating portion.
5 . An electronic device comprising:
a case comprising a ground portion;
a printed wiring board comprising an edge portion and a fixing hole located adjacent to the edge portion, the printed wiring board being housed in the case;
a land provided at a position outside an area extending along the edge portion, the area including a portion between the edge portion and the fixing hole, the land comprising a part extending from a vicinity of the edge portion toward a center portion of the printed wiring board;
a conductive plating portion covering an inner surface of the fixing hole, the conductive plating portion being provided to be continuous with the land; and
a screw being screwed in the fixing hole and electrically connecting the ground portion and the land.
6 . The device of claim 5 ,
wherein the printed wiring board comprises a first face that is provided with the land and a second face that is opposite the first face, and
wherein the conductive plating portion is configured to extend across the first face and the second face.
7 . The device of claim 6 ,
wherein the printed wiring board comprises a second land that is provided on the second face to be continuous with the conductive plating portion.
8 . An electronic device comprising:
a case comprising a ground portion;
a printed wiring board comprising an edge portion and a fixing hole located adjacent to the edge portion, the printed wiring board being housed in the case;
a first land provided at a position outside an area extending along the edge portion, the area including a portion between the edge portion and the fixing hole, the first land comprising a part extending from a vicinity of the edge portion along the edge portion;
a conductive plating portion covering an inner surface of the fixing hole, the conductive plating portion being provided to be continuous with the first land;
an end face of the conductive plating portion having a smaller width than the first land, the end face extending at a portion between the fixing hole and the edge portion along the fixing hole; and
a screw being screwed in the fixing hole and electrically connecting the ground portion, the first land, and the end face of the conductive portion.